Active solder and preparation method thereof

A technology of active solder, mass percentage, applied in the direction of manufacturing tools, welding equipment, metal processing equipment, etc., can solve problems affecting solderability of solder and joint mechanical properties, high-temperature oxidation of active elements, etc., to achieve good interface bonding, The effect of hindering the growth of cracks and simple equipment

Inactive Publication Date: 2008-12-31
HARBIN INST OF TECH
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  • Summary
  • Abstract
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  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problem that the preparation of the existing active solder needs to go through a smelting process, there is melting and solidification of the solder, and high-temperature oxidation of active elements occurs, thereby affecting the solderability of the solder and the mechanical properties of the joint. Provided is an active solder and a preparation method thereof

Method used

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  • Active solder and preparation method thereof
  • Active solder and preparation method thereof
  • Active solder and preparation method thereof

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specific Embodiment approach 1

[0019] Embodiment 1: In this embodiment, the active solder is composed of 15%-60% Ag, 15%-60% Cu, 2%-15% Ti, 0.1%-0.42% mixed RE and the remainder Sn composition.

specific Embodiment approach 2

[0020] Specific embodiment 2: In this embodiment, the active solder is composed of 15%-60% Ag, 15%-60% Cu, 2%-15% TiH by mass percentage 2 , 0.1% to 0.42% of mixed RE and the balance of Sn.

specific Embodiment approach 3

[0021] Embodiment 3: In this embodiment, the active solder is composed of 15%-60% Ag, 15%-60% Cu, 2%-15% Ti and the balance of Sn according to the mass percentage.

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Abstract

The invention provides an active solder and a preparation method thereof and relates to a solder and a preparation method thereof. The method of the invention solves the problems that the preparation of the existing active solder needs to be smelted, thus influencing the weldability of the solder and the mechanical properties of joints. The solder of the invention consists of Ag, Cu, Sn and one of Ti or TiH2. In the solder of the invention, the Ag and the Cu are mixed with RE, the Sn and one of the Ti or the TiH2. The preparation method for the solder in the invention comprises the steps as follows: raw material of the active solder is added to a planetary ball mill for ball milling. After being brazed by adopting the method of the invention, the interface joint of the solder has good combination with the interface without air vent and crack, and forms a thinner responding layer with the side of mother metal, wherein, the responding layer can improve the mechanical properties of joints; and the shear strength of the soldering joint of the solder prepared by using the method of the invention can reach 11.56MPa.

Description

technical field [0001] The invention relates to a brazing material and a preparation method thereof. Background technique [0002] At present, the preparation of most active solders requires a smelting process. There is melting and solidification of the solder, which will cause high-temperature oxidation of active elements, which affects the solderability of the solder and the mechanical properties of the joint. At the same time, it will bring problems such as increased production cost, complicated control process and unsatisfactory elimination effect. SUMMARY OF THE INVENTION [0003] The purpose of the present invention is to solve the problem that the preparation of the existing active solder needs to go through a smelting process, and there is melting and solidification of the solder, resulting in the phenomenon of high temperature oxidation of active elements, thereby affecting the solderability of the solder and the problem of the mechanical properties of the joint, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/24
Inventor 何鹏冯吉才谢凤春张九海曹健
Owner HARBIN INST OF TECH
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