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An Improved Vacuum Pump System

A vacuum pump and pump control technology, applied in the field of vacuum systems, can solve problems such as rising product defect rates, achieve low cost, prevent gas backflow, and be easy to implement

Inactive Publication Date: 2011-11-30
SEMICON MFG INT (SHANGHAI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The defect of this prior art is that when the first cavity 30 is in a vacuum state and the isolation valve 33 is opened, if another cavity 10 that is still in the atmospheric state is opened due to human error or software setting defects The needle valve 11 or the isolation valve 13 will form the gas backflow to the cavity 30, thus increasing the defect rate of the product in the cavity 30

Method used

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  • An Improved Vacuum Pump System
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Embodiment Construction

[0011] The idea of ​​the present invention is to prevent gas backflow phenomenon by adding specific valves in the structure of the existing vacuum pump system.

[0012] see figure 2 , the vacuum pump system of the present invention includes a dry pump and two wafer boat transfer chambers 50, 70 controlled by it. The two cavities 50 , 70 respectively include a needle valve 51 , 71 and an isolation valve 53 , 73 . Needle valves 51, 71 and isolation valves 53, 73 generally adopt normally closed valves, that is, they will be closed in normal state and opened during ventilation. External clean and dry air enters the cavities 10, 30 through the above-mentioned valves.

[0013] In order to prevent gas backflow caused by human misoperation or software setting defects, the vacuum pump system of the present invention adds a normally open valve 55, 75 opposite to the isolation valve behind the chambers 50, 70, respectively. Wherein, the gas source of the normally open valve 55 is dir...

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Abstract

The present invention provides an improved vacuum pump system, which includes a dry pump, a first cavity and a second cavity controlled by the dry pump, and several normally closed valves, through which external air enters the cavity, wherein , the vacuum pump system also includes a first normally open valve and a second normally open valve, the first normally open valve is set between the gas source of the first cavity and the second cavity, the second normally open valve is set Between the second cavity and the gas source of the first cavity. Compared with the prior art, the method of the present invention is easy to implement, has relatively low cost, and can effectively prevent the phenomenon of gas backflow caused by human misoperation or software setting defects.

Description

technical field [0001] The invention relates to a vacuum system technology, in particular to an improved vacuum pump system capable of preventing gas backflow. Background technique [0002] In the manufacture of semiconductors and other precision components, a certain vacuum environment is required to process them in vacuum. The current vacuum system uses two mechanical pumps (pumps) and a diffusion pump in series to achieve the desired vacuum degree for sputtering. Use a mechanical pump for rough pumping, use a diffusion pump for fine pumping, close the valve of the diffusion pump during rough pumping, and only open the valve of the mechanical pump (roughing valve). valve (backing valve), and finally open the main valve (main valve) to avoid gas backflow. [0003] see figure 1 , the vacuum pump system in the prior art usually includes a dry pump and two vacuum cassette transport chambers (Vacuum Cassette Elevator, VCE) 10 , 30 controlled by it. The two chambers 10 , 30 ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/56
Inventor 顾琛许国青杨晨董家伟
Owner SEMICON MFG INT (SHANGHAI) CORP