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Semiconductor device, lead frame, and microphone package therefor

A semiconductor and microphone technology, which is applied in the manufacture of semiconductor devices, semiconductor electrostatic transducers, semiconductor/solid-state devices, etc., can solve the problem of electromagnetic noise entering the cavity, and achieve the effect of improving the shielding effect.

Inactive Publication Date: 2009-02-11
YAMAHA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, electromagnetic noise may enter the cavity through the gap

Method used

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  • Semiconductor device, lead frame, and microphone package therefor
  • Semiconductor device, lead frame, and microphone package therefor
  • Semiconductor device, lead frame, and microphone package therefor

Examples

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Embodiment Construction

[0040] The present invention is described in further detail by way of examples with reference to the accompanying drawings.

[0041] A semiconductor device 1 according to a preferred embodiment of the present invention is described with reference to FIGS. 1 to 8 . The semiconductor device 1 is designed to detect pressure changes such as sound pressure generated in an external space, and is of a surface mount type manufactured using a lead frame.

[0042] As shown in FIGS. 1 to 3 , a semiconductor device 1 includes a molding board 3 having a rectangular shape in plan view, a microphone chip (or sensor chip) 5 and a companion chip (companion chip) formed on a surface 3 a of the molding board 3 . ) 7, and a cover 9 arranged above the molding board 3 so as to cover the microphone chip 5 and the companion chip 7.

[0043] The molded board 3 includes a platform 11 that is rectangular in plan view so as to form a surface 3a of the molded board 3, a plurality of lead terminals (for e...

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PUM

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Abstract

The invention provides a semiconductor device, lead frame, and microphone package therefor. A semiconductor device is constituted of a mold sheet for mounting a sensor chip and a cover having a box-like shape, both of which are combined together so as to form a cavity therebetween. The mold sheet includes a stage having a rectangular shape in a plan view, a plurality of cutouts formed in the periphery of the stage, and a plurality of lead terminals arranged inside of the cutouts. The lead terminals include a plurality of connection portions electrically connected to the sensor chip and a plurality of support leads which are externally extended from the periphery of the stage. The stage and the lead terminals are sealed with a mold resin, by which they are electrically insulated from each other. The recesses of the support leads are sealed with the insulating resin mold relative to the surface of the mold sheet so as to mount the opening end of the cover.

Description

technical field [0001] The present invention relates to a semiconductor device having a sensor chip and a lead frame, which is packaged in a microphone package. [0002] This application claims priority from Japanese Patent Application No. 2007-206724, the contents of which are incorporated herein by reference. Background technique [0003] In a conventionally known semiconductor device, a sensor chip (for automatic sensing of sound, etc.) is incorporated into a hollow cavity defined by a substrate and a cover and mounted on the surface of the substrate. Different types of semiconductor devices are disclosed in various documents such as Patent Document 1. [0004] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2007-66967 [0005] Patent Document 1 teaches a semiconductor device having a substrate including a rectangular platform for mounting a sensor chip thereon, a plurality of leads, and a resin layer, the leads being provided in a peripheral a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81B7/00H01L23/552H01L23/495H04R23/00
CPCH01L2224/49175H05K5/0095H01L2224/48091H04R19/005H01L2224/48137H01L2924/3025H01L2224/48247H01L2924/16151H01L2924/16152H01L2924/00014H01L2924/00H01L23/02H04R19/04H01L21/56
Inventor 白坂健一
Owner YAMAHA CORP