Method and system for quickly testing growth of tin crystal whisker
A test method and test system technology, applied in the test field, can solve the problems such as the great difference in the incubation period of tin whisker growth
Inactive Publication Date: 2009-02-11
BEIJING SHENGTAOPING TEST ENG TECH RES INST
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Problems solved by technology
[0005] In the process of realizing the present invention, the inventor has found that there are at least the following problems in the prior art: under different conditions, the latent period of tin (tin alloy) tin whisker growth varies greatly
There is no domestic research on how to adopt appropriate test pretreatment procedures and environmental acceleration simulation conditions to effectively activate the growth of tin (tin alloy) whiskers
Method used
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[0024] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.
[0025] The flow process of the rapid test method of a kind of tin whisker growth of the embodiment of the present invention is as follows figure 1 shown, including the following steps:
[0026] Step s101, setting the external stress of the sample to be tested. Select suitable external stress to accelerate the growth of component lead tin (tin alloy) tin whisker, the external stress adopted in the present embodiment mainly is temperature and humidity, and the test condition that adopts mainly is the storage under constant temperature and humidity condition. and temperature cycling. In the present embodiment, the parameters of the set external stress are shown in Table 1:...
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The invention discloses a rapid test method for the growth of a tin whisker. The rapid test method comprises the following steps: the outside stress of a sample to be tested is set; the primary check of the sample to be tested is carried out, the initial length and the initial density of the tin whisker in the sample to be tested are determined; the growth of the tin whisker of the sample to be tested is carried out under the set outside stress; and the length and the density of the tin whisker of the sample to be tested are measured. The invention further discloses a rapid test system for the growth of the tin whisker, and the rapid test system comprises an outside stress control device and a measuring device. The invention selects the environmental simulation accelerated test for shortening the latency period of the growth of the tin whisker through the test of the outside stress control device, thereby being able to determine the conditions and the time of the latency period of the growth of the tin whisker; in addition, the embodiment of the invention can realize the measurement of the length and the density of the tin whisker.
Description
technical field [0001] The invention relates to the technical field of testing, in particular to a rapid testing method and system for tin whisker growth. Background technique [0002] In the production and assembly process of electronic components, tin plating (tin alloy) and soldering processes are often used. The tin (tin alloy) coating layer of various substrates will grow whisker-like crystals with a diameter of several microns and a length of tens of microns to more than ten millimeters on the surface under certain conditions. , bending, noodle kinks, slits and other shapes. The growth of tin whiskers is essentially a spontaneous, protruding growth phenomenon on the surface, which is not limited by conditions such as electric field, humidity and air pressure, and the growth rate can be fast or slow. Coatings formed by electroplating and other deposition methods are at risk of whisker growth. Tin, zinc and cadmium coatings are particularly susceptible to whisker growt...
Claims
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Inventor 王群勇刘欣伟阳辉白桦刘燕芳陈冬梅孙旭朋陈宇
Owner BEIJING SHENGTAOPING TEST ENG TECH RES INST