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Resin for blending with rubber, and rubber composition

A rubber composition and rubber technology, applied in the field of rubber compounding resin and rubber composition, can solve problems such as insufficient rubber adhesion, and achieve high adhesion effect

Inactive Publication Date: 2009-03-04
SUMITOMO BAKELITE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, depending on the type of synthetic rubber (such as butadiene rubber (BR), ethylene-propylene-diene rubber (EPDM), etc.), the adhesiveness of the rubber may not be sufficient even if the adhesiveness is imparted by an alkylphenol-formaldehyde resin.

Method used

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  • Resin for blending with rubber, and rubber composition

Examples

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Effect test

Embodiment 1

[0044] In a reactor with a stirring device, a reflux condenser and a thermometer, 1000 parts of p-tert-octylphenol, 1000 parts of acetaldehyde and 10 parts of p-toluenesulfonic acid were put into the reaction vessel under reflux for 3 hours. Next, dehydration and de-p-tert-octylphenol were carried out under reduced pressure until the amount of moisture and free monomer reached a predetermined level, and then it was taken out from the reactor to obtain resin A for rubber compounding. The softening point of this resin A was 120° C., and the free p-tert-octylphenol content was 3.0%.

Embodiment 2

[0046] In a reactor with a stirring device, a reflux condenser and a thermometer, 1000 parts of p-tert-octylphenol, 1100 parts of acetaldehyde and 10 parts of p-toluenesulfonic acid were put into the reaction vessel for 3 hours under reflux. Next, dehydration and de-p-tert-octylphenol were carried out under reduced pressure until the predetermined amount of water and free monomers was reached, and then it was taken out from the reactor to obtain resin B for rubber compounding. The softening point of this resin B was 140° C., and the free p-tert-octylphenol content was 2.0%.

Embodiment 3

[0048] In a reactor with a stirring device, a reflux condenser and a thermometer, 1000 parts of p-tert-butylphenol, 900 parts of acetaldehyde and 10 parts of p-toluenesulfonic acid were put in, and reacted under reflux for 3 hours. Next, dehydration and removal of p-tert-butylphenol were carried out under reduced pressure until the predetermined amount of moisture and free monomers was reached, and then it was taken out from the reactor to obtain resin C for rubber compounding. The softening point of this resin C was 121° C., and the amount of free p-tert-butylphenol was 5.0%.

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Abstract

The main object is to provide an alkylphenol resin which, when blended with a rubber, can impart a high adhesion property to the resulting composition and also provide a rubber composition using the resin. A resin intended to be blended with a rubber can be synthesized with a phenol having a para-substituted alkyl group having 1 to 18 carbon atoms and an aldehyde other than formaldehyde.

Description

technical field [0001] The invention relates to a resin for rubber compounding and a rubber composition. Background technique [0002] Conventionally, alkylphenol-formaldehyde resins synthesized from petroleum resins or phenols having para-substituted alkyl groups having 1 to 18 carbon atoms and formaldehyde have been used as viscosity-imparting materials for unvulcanized natural rubber and synthetic rubber. Among them, for synthetic rubbers that are less likely to exhibit tackiness when not vulcanized, alkylphenol-formaldehyde resins having higher tack-imparting properties are used (see Patent Document 1). [0003] However, depending on the type of synthetic rubber (eg, butadiene rubber (BR), ethylene-propylene diene rubber (EPDM), etc.), the adhesiveness of the rubber may not be sufficient even if the adhesiveness is imparted by an alkylphenol-formaldehyde resin. [0004] Patent Document 1: Japanese Patent Laid-Open No. 2005-350627 Contents of the invention [0005] An...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G8/12C08L21/00C08L61/08
CPCC08L61/06C09J161/06C08L21/00C08K3/0033C08G8/04C08L2666/08C08K3/013C08L2666/16C08G8/12
Inventor 松本康伸
Owner SUMITOMO BAKELITE CO LTD
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