Lifting device

Abstract

The invention provides a lifting device that moves together with a semiconductor device during the process of semiconductor processing / treatment. The device comprises a pressure cylinder, a power transmission part, and a supporting and lifting part, wherein, the pressure cylinder is connected with the power transmission part so as to transmit motion mechanical energy to the power transmission part; the power transmission part which is arranged between the pressure cylinder and the supporting and lifting part is used for transmitting the motion mechanical power generated by the pressure cylinder to the supporting and lifting part; and the motion mechanical power from the power transmission part drives the supporting and lifting part to move together with the semiconductor device. The supporting and lifting device further comprises a horizontal adjustment part, which is positioned between the supporting and lifting part and the power transmission part or between the power transmission part and the pressure cylinder, and used for adjusting the horizontality of the top of the supporting and lifting part. The lifting device provided by the invention can facilitate horizontal adjustment, but also keep such semiconductor device as a wafer which moves along with the lifting device balanced during motion processes such as departure from a seat or approach to a seat and the like.

Description

technical field [0001] The invention relates to the technical field of microelectronics, in particular to a lifting device for carrying wafers and other processed devices to move in semiconductor processing / processing technology. Background technique [0002] As we all know, integrated circuits are manufactured from semiconductor devices such as semiconductor wafers through many processing / processing processes. With the rapid development of electronic technology, people have higher and higher requirements for the integration of integrated circuits, which requires companies that produce integrated circuits to continuously improve the processing capabilities of semiconductor devices. The processing of semiconductor devices often needs to be carried out in a reaction chamber. For example, in the manufacturing process of an integrated circuit, it is often necessary to make extremely fine-sized patterns on a wafer in the reaction chamber. The most important way to form these fin...

AI Technical Summary

Problems solved by technology

It can be seen that the existing lifting device is not only inconvenient to operate, troublesome and time-consuming to adjust the level, but also the adjustment accuracy is not high enough to ensure that the columnar lifting structure is in a horizontal state.

Therefore, when the existing lifting device is used to carry semiconductor devices such as wafers for movement, it is often difficult to keep the semiconductor devices such as wafers in a horizontal state, which causes the problems mentioned above, and ultimately leads to insufficient processing yield.

Images