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Method of interconnecting layers of a printed circuit board

A printed circuit board, electrical connection technology, applied in the directions of printed circuit, printed circuit, printed circuit manufacturing, etc., can solve the problems of high resistivity, low adhesion, and insufficient heat conduction.

Inactive Publication Date: 2009-04-01
SAMSUNG ELECTRO MECHANICS CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the resistivity of the conductive paste is greater than that of copper plating, the adhesive force of the conductive paste is lower than that of copper plating, and the polymer in the conductive paste prevents sufficient heat conduction

Method used

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  • Method of interconnecting layers of a printed circuit board
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  • Method of interconnecting layers of a printed circuit board

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Embodiment Construction

[0020] A method for interconnecting multiple layers of a printed circuit board according to some embodiments of the present invention will be described in more detail below with reference to the accompanying drawings, in which the same or corresponding elements are denoted by the same reference numerals, and the same as those in the drawings No. is irrelevant and will not be repeated here.

[0021] figure 1 is a flowchart of a method of interconnecting multiple layers of a printed circuit board according to the first disclosed embodiment of the present invention, and Figure 2 to Figure 6 is a cross-sectional view showing the process of the method of interconnecting layers of a printed circuit board according to the first disclosed embodiment of the present invention. exist Figure 2 to Figure 6 In , a printed circuit board 10 , a first metal layer 11 , a plurality of protrusions 12 , an insulating layer 13 , a second metal layer 14 , a circuit pattern 15 , metal particles 1...

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Abstract

A method of interconnecting layers of a printed circuit board is disclosed. The method includes: forming at least one bump on a first metal layer using a conductive paste containing carbon nanotubes, stacking an insulation layer on the first metal layer such that the bumps penetrate the insulation layer, and stacking a second metal layer on the insulation layer such that the second metal layer is electrically connected with the first metal layer by the bump.

Description

[0001] Cross References to Related Applications [0002] This application claims priority from Korean Patent Application No. 10-2007-0097651 filed with the Korean Intellectual Property Office on September 28, 2007, the entire disclosure of which is hereby incorporated by reference in its entirety. technical field [0003] The invention relates to a method of interconnecting layers of a printed circuit board. Background technique [0004] With the development of electronic parts, there is a need to improve the performance of HDI (High Density Interconnect) boards with fine-pitch wiring. [0005] This may involve interconnecting different layers of the circuit pattern and increasing design freedom. [0006] According to the prior art, a method for manufacturing a multilayer printed circuit board includes: forming a plating layer through drilling, electroless plating, and electroplating; and then forming a plurality of circuit layers. However, this method of manufacturing cir...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/40H05K3/42
CPCH05K2203/1461B82Y10/00H05K2201/10378H05K1/095H05K2201/026H05K3/4647H05K3/4614H05K2201/0355H05K3/4069Y10T29/49126B82Y30/00
Inventor 李应硕金永镇白承铉崔在鹏吴怜锡徐大宇柳济光睦智秀柳彰燮
Owner SAMSUNG ELECTRO MECHANICS CO LTD