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Triode and manufacturing method thereof

A manufacturing method and triode technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve the problems of high cost of triodes, achieve the effects of reducing weight, saving materials, and preventing deformation

Active Publication Date: 2009-04-08
SHENZHEN JINGDAO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, it is necessary to provide a manufacturing method for reducing the cost of the triode for the problem of high cost of the traditional triode

Method used

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  • Triode and manufacturing method thereof
  • Triode and manufacturing method thereof
  • Triode and manufacturing method thereof

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Embodiment Construction

[0027] The encapsulated triode mainly includes the chip, the frame, the bonding wire connecting the chip and the frame, and the plastic molding compound that protects the chip and the bonding wire. In the following embodiments, according to the production and use performance requirements of the triode, without affecting it, by reducing the thickness of the frame, the material can be saved to reduce the cost of materials, while the weight of the product is reduced, so that a single product can be transported. Cost reduction.

[0028] Such as figure 1 The frame 100 of the triode shown includes a main body 110, pins 120, a middle rib 130 and a bottom rib 140. The pin 120 includes an emitter pin 122, a collector pin 124, and a base pin 126. Wherein, the collector pin 124 is directly connected to the body 110, and the emitter pin 122 and the base pin 126 are located on both sides of the collector pin 124, respectively. The middle rib 130 is connected to the emitter pin 122, the collec...

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Abstract

A manufacturing method of a triode comprises the following steps: a chip is welded on a frame the thickness of a pin of which is 0.36-0.44mm; bonding wires are bonded to connect the chip and the pin of the frame; and a plastic package material is used for protecting plastic package forming. The manufacturing method of the triode saves materials, reduces material cost, decreases the weight of products and reduces the transportation cost of a single product by reducing the thickness of the frame. In addition, a triode is provided by the invention.

Description

【Technical Field】 [0001] The invention relates to the technical field of electronic components, in particular to a triode and a manufacturing method thereof. 【Background technique】 [0002] The triode is small in size, light in weight, low in power consumption, long in life, and high in reliability. It has been widely used in broadcasting, television, communications, radar, computers, automatic control devices, electronic instruments, household appliances and other fields for amplification, oscillation, switching, etc. effect. [0003] With the development of semiconductor technology, the packaging technology of triode is also advancing rapidly. In order to reduce costs, continuous innovations are being made in the process, such as the reduction of the feature size of semiconductor chips, the introduction of a large number of new materials, new processes and new device structures. [0004] Usually, the frame of the triode is made of metal material, which plays a role of conductio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/50H01L21/60H01L21/607H01L23/495
CPCH01L2224/49171H01L2224/48247
Inventor 高燕辉刘谋迪李忠
Owner SHENZHEN JINGDAO ELECTRONICS
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