Apparatus for manufacturing hybrid integrated circuit by double-beam double-wavelength laser three-dimensional micro-cladding

A dual-wavelength laser, integrated circuit-based technology, used in laser welding equipment, manufacturing tools, welding equipment, etc.

Inactive Publication Date: 2009-04-15
无锡浩波光电子有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] There are no relevant reports at home and abroad about the technology and equipment for manufacturing hybrid integrated circuit substrates by three-dimensional numerical control micro-cladding with dual-beam and dual-wavelength lasers.

Method used

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  • Apparatus for manufacturing hybrid integrated circuit by double-beam double-wavelength laser three-dimensional micro-cladding

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Embodiment Construction

[0019] The present invention is described below in conjunction with accompanying drawing.

[0020] The whole system mainly includes the following five parts:

[0021] (1) The laser micro cladding dual-beam dual-wavelength laser system is composed of parts 2, 3, 5-21, 28, and the water-cooled constant temperature unit of the laser is composed of parts 38 and 39. .

[0022] (2) The multi-channel intelligent micro-spray powder cladding system consists of components 24 and 28.

[0023] (3) The three-dimensional intelligent vision detection and recognition feedback control system is composed of components 22 and 30 .

[0024] (4) The five-axis parallel control vibrating mirror and table moving system consists of components 1, 4, 26, 27, and 31.

[0025] (5) The central intelligent control module of the system is composed of components 35, 36, 34, and 37.

[0026] To be explained separately below.

[0027] 1. The dual-beam dual-wavelength laser system is mainly composed of comp...

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Abstract

The invention relates to a device for manufacturing base plates of hybrid integrated circuits by making use of three-dimensional micro-cladding of laser with dual beam and wavelength, which belongs to the technical field of manufacturing hybrid integrated circuits in electricity industries. The device uses an Nd: YAG laser of a symmetrical dual-Z type resonant cavity to transmit laser with dual beam and wavelength through a right angle prism, configures multi-channel intelligent micro-jet powder feeding, controls the moving of an oscillating mirror and a workbench by adopting a five-axle linkage technology and feeds back through a three-dimensional intelligent vision inspection and recognition device, a central control module of the system controls the running of the integral machine, and therefore realizes the laser three-dimensional micro-cladding manufacturing of base plates of hybrid integrated circuits, multilayer and three-dimensional circuit boards.

Description

[0001] The invention relates to a device for manufacturing hybrid integrated circuit substrates by three-dimensional micro cladding with double-beam and double-wavelength lasers, and belongs to the technical field of hybrid integrated circuit manufacturing in the electronics industry. Background technique [0002] There are no relevant reports at home and abroad about the technology and equipment for manufacturing hybrid integrated circuit substrates by three-dimensional numerical control micro-cladding with dual-beam and dual-wavelength lasers. [0003] The manufacture of hybrid integrated circuit substrates, multilayer and three-dimensional circuit boards is the core pillar of the electronics industry, especially the manufacture of core chips and high-end integrated circuit chips in commercial computers, electronics and communication equipment is the trend of the world's technology economy and industry And pillars, the development basis of this industry is the "industrial CNC...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C24/10B23K26/34
Inventor 王涛姚建铨刘晓雯李福增扬恺凯金忠伟朱超男陆晶
Owner 无锡浩波光电子有限公司
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