Gas supply device, semiconductor manufacturing device and component for gas supply device

A technology for gas supply and manufacturing equipment, applied in semiconductor/solid-state device manufacturing, gas/liquid distribution and storage, electrical components, etc., can solve problems such as shortening period and production reduction, and achieve the effect of reducing metal impurities and improving productivity

Inactive Publication Date: 2009-04-15
TOKYO ELECTRON LTD
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, with the prior art described above, time and cost are required for precoating, and the period until the next cleaning is shortened due to the formation of the precoat, resulting in a problem of reduced production.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Gas supply device, semiconductor manufacturing device and component for gas supply device
  • Gas supply device, semiconductor manufacturing device and component for gas supply device
  • Gas supply device, semiconductor manufacturing device and component for gas supply device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

[0026] figure 1 It is a figure which schematically shows the structure of the gas supply apparatus which concerns on embodiment of this invention. exist figure 1 In the gas supply device 1 shown, as the gas control mechanism, a manual valve 2, a pressure control mechanism (regulator) 3, a pressure sensor 4 for pressure detection, and a check valve 5 are provided in this order from the upstream side of the gas supply direction. , On-off valves 6a, 6b, a mass flow controller 7 as a flow control mechanism, and a metal filter 8.

[0027] In addition, at the gas inlet of the gas supply device 1 ( figure 1 The left side) end portion is provided with a gas supply pipeline connection block (block) 20 for connecting the gas supply pipeline from the gas supply source. A filter 20b is inserted into the pipe connection port 20a of the gas supply pipe connection base 2...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The present invention provides a gas supply device, semiconductor manufacturing equipment and components for gas supply device which can reduce the possibility of generating metal impurities by the gas supply device compared with the prior art. A connection seat 22 of a gas supply device 1 is composed of a corrosion-resistant seat component 22a and a metal seat component 22b, wherein, the corrosion-resistant seat component 22a is composed of ceramics or noble metals having corrosion resistance to the gas, and constitutes a contact gas section contacted to the gas; and the metal seat component 22b has an jogging hole 28 for jogging the corrosion-resistant seat component 22a, and the metal seat component 22b protects the corrosion-resistant seat component 22a.

Description

technical field [0001] The present invention relates to a gas supply device for supplying gas from a gas supply source into a processing chamber to be processed, a semiconductor manufacturing device using the gas supply device, and components for the gas supply device. Background technique [0002] It is known from the prior art that, in a semiconductor manufacturing apparatus for performing desired processing on a target object such as a semiconductor wafer or an LCD, a predetermined gas is supplied from a gas supply source into a processing chamber for processing the object to be processed. Film formation processing, etching processing, etc. (refer patent document 1). [0003] In addition, as a gas supply device used in the above-mentioned semiconductor manufacturing equipment, etc., a plurality of gas control mechanisms configured to control gas supply, such as gas flow control mechanisms (mass flow controllers, etc.), valve mechanisms, etc., are known. , gas pressure co...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L21/00C23C16/455
CPCF17D1/04H01L21/67017C23C16/45561H01J37/3244
Inventor 守谷修司
Owner TOKYO ELECTRON LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products