Multi-layer wiring board, interconnection blank and interconnection element capable of being patterned, and manufacturing method of the multi-layer wiring board

Abstract

Provided is a manufacturing method of a multi-layer wiring substrate. A plurality of multi-layer metal plates 1 comprising a bump forming metal layer 2 and an etching stop layer 3, formed by a wiring film 4a and a bump forming metal layer 2 are prepared, and those are multi-layered by repeating in turn a layering process in such a manner as the wiring film 4a of another multi-layer metal plate is overlapped on a forming surface of a bump 2a of one multi-layer metal plate, while polishing the surface of the metal plate 1 with a polishing machine 11a for a multi-layer wiring film substrate having for instance a metal plate holding means 13 by a vacuum absorbing, a blade holding means 25 for holding the blade 26 above the metal plate 1, a height regulating mechanism 20 for regulating the height of the blade holding means 25 and a blade parallel moving mechanism 15 for moving the blade holding means 25 mutually in parallel with the face of the metal plate 1; making a Vicker's hardness of the bump 2a and the metal layer to be contacted to the bump 2a as 80 to 150 Hv just before the above layering, doing an oxidation and reduction treatment of one surface or both of the bump 2a of the metal plate 1 and of other wiring film 11 to be layered thereon and thereafter doing an oxidation treatment and a reduction treatment for improving an electrical connectabi1ity and stability.

Description

[0001] The application date is March 27, 2002, the application number is "02800882.0 (PCT / JP02 / 02982)", and the invention title is "multilayer wiring substrate, multilayer wiring substrate manufacturing method, multilayer wiring substrate grinding A divisional application of the invention patent application for machine and metal plate for manufacturing wiring substrates. technical field [0002] The present invention relates to a method for manufacturing a multilayer wiring board and a metal plate for forming a wiring board, and in particular to a method for manufacturing a multilayer wiring board that manufactures a highly reliable wiring board through high integration with microscopic holes, and a method for manufacturing a multilayer wiring board with micro The high integration of holes forms a highly reliable metal plate for wiring boards. Background technique [0003] For higher integration of wiring boards, it is necessary to multilayer the wiring boards and to form co...

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Problems solved by technology

[0008] In addition, the above-mentioned metal plate is made of copper. This is because the part between the formed bump and the wiring film connected to the bump is intended to be electrically connected by crimping the copper and the copper layer. However, crimping alone will There may be cases where conduction cannot be obtained at the beginning, or even if conduction is obtained, the crimping surface may deteriorate due to the accelerated test of the assumption of long-term use, or worse, conduction may become impossible

[0009] The deterioration of the crimping part is related to the hardness of the bump. Specifically, the resin and other impurities, moisture, oxygen, etc. that make up the insulating layer gradually invade the crimping part, or the bumps and copper layers or wiring Oxidation of the crimping surface of the film gradually produces copper oxide and other films. As a result, the resistance between the bump and the copper layer or the wiring film increases, and there is a problem that the long-term connection reliability is reduced.

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