Methods for low cost manufacturing of complex layered materials and devices

Abstract

A process for manufacturing a device includes performing a plurality of non-bonding processes during at least one web-based manufacturing stage and during at least one sheet-based manufacturing stage. The processes may be performed by a plurality of modules. The modules may be independently controlled and / or monitored. The modules may be interchangeable. One or more modules may receive and / or pass material to another module. The devices that are manufactured may be a layered device, a smart card, a sensor, an actuator, an in vitro diagnostic device, a microfluidic device, or a laminar product. An apparatus for manufacturing device includes at least one web-based manufacturing component and at least one sheet-based manufacturing component. The at least one web-based manufacturing component and the at least one sheet-based manufacturing component are configured to perform a plurality of non-bonding processes.

Description

technical field [0001] The present invention generally relates to the fabrication of composite layered materials and devices having one or more layers of suitably modified, altered or added materials. More particularly, the present invention relates to methods of manufacturing these materials and devices at low cost, in variable quantities, and at the same time with a high degree of variability and precision complexity, under varying degrees of manual or automatic control. Additionally, the present invention relates to methods for efficiently fabricating layered materials and devices of varying functionality and complexity using the same fabrication facility. The field of the invention also extends to the efficient fabrication of complex polymeric materials and devices, the fabrication of which features variable and controllable dimensions from centimeters to nanometers. Background technique [0002] In the following discussion, reference is made to specific structures and / ...

AI Technical Summary

Problems solved by technology

This limits the layer thicknesses employed and the number of layers that can be combined and manipulated on this line

This is problematic for many layered material applications that require larger environmental interfaces, larger fluid capacities, larger operational structures, or higher part strength, or a large number of bonded layers, all of which feature both tend to make the resulting devices rather rigid and thus severely limit the applicability of reel-to-reel production methods

[0025] Another disadvantage of reel-to-reel handling systems is that the substrate needs to maintain a generally planar shape with little or no protrusions on the outer surface

Because this method also defines the substrate thickness, which further limits the design of the product, often requiring larger 3-dimensional shaped objects to provide functionality such as connection to external devices or provision of internal liquid storage chambers

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