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Island-shaped loading plate and preparation method thereof

A manufacturing method and a technology for a carrier plate, which are applied in the manufacture of semiconductor/solid-state devices, electrical components, and electrical solid-state devices, etc., can solve problems such as reducing the energy of light output, and achieve the effect of avoiding second-degree absorption and improving light extraction efficiency.

Inactive Publication Date: 2009-04-22
IND TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

exist figure 1 In the known flip-chip soldering structure, the light-emitting component 11 is fixed to the carrier substrate 13 with metal balls 12, but the light emitted from the bottom of the light-emitting component will still be reflected into the light-emitting component 11 through the surface of the carrier substrate 13, resulting in two High degree of absorption, weakening the energy of the last light

Method used

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  • Island-shaped loading plate and preparation method thereof
  • Island-shaped loading plate and preparation method thereof
  • Island-shaped loading plate and preparation method thereof

Examples

Experimental program
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Embodiment Construction

[0073] Please refer to figure 2 , is a schematic diagram of the first embodiment of the present invention. An island-shaped carrying board 100 is used for carrying a light-emitting component 21 , and the light-emitting component 21 has an electrical contact 22 . The island-shaped carrier board 100 includes: a substrate 23 , an island-shaped structure 24 and a conductive layer 25 .

[0074] The substrate 23 is a material with thermal conductivity, which may be a semiconductor material, a ceramic material, a metal material, or the like.

[0075] The island structure 24 is formed on the substrate 23 and corresponds to the electrical contact 22 of the light emitting element 21 . The island structure 24 has a top surface 26 and an inclined surface 27 .

[0076] The conductive layer 25 covers the top surface 26 of the island structure 24 for electrically connecting the electrical contact 22 of the light emitting element 21 corresponding to the island structure 24 . The conducti...

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Abstract

The invention discloses an island-style carrying board and a production method thereof, the island-style carrying board is used for carrying at least one light-emitting component, the light-emitting component is provided with at least one electric contact, the island-style carrying board comprises a substrate; at least one island-style structure which is positioned on the substrate and corresponding to the electric contact, the island-style structure is provided with a top surface and a slope; and a conductive layer which is arranged at the surface of the island-style structure and at least covers the top surface to be electrically connected with the electric contact. The island-style carrying board can improve the light extraction efficiency of the light-emitting component and avoid the energy loss of the secondary absorption as the light-emitting component emits the light from the lower part and the light is re-reflected back to the light-emitting component.

Description

technical field [0001] The invention relates to a carrying substrate, in particular to a carrying substrate with an island structure for carrying a light-emitting component and a manufacturing method thereof. Background technique [0002] The principle of light emitting diode (Light Emitting Diode, LED) is to use different doping [Doping] to form a p-n junction. When electrons and holes are combined, energy is released in the form of light. The light form is basically a collection of infinite point light sources. . Light-emitting diodes have the advantages of high durability, long life, light weight, low power consumption, etc., and do not contain harmful substances such as mercury. Therefore, today's lighting market places great expectations on light-emitting diode lighting. [0003] The luminous efficiency of a light emitting diode is generally called the external quantum efficiency (External Quantum Efficiency; EQE) of the component, which is the product of the internal ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/488H01L23/13H01L21/48H01L33/00
CPCH01L24/97H01L2224/11
Inventor 郭义德蔡政达刘柏均
Owner IND TECH RES INST