Quartz crystal oscillator encapsulation construction

A technology of quartz crystal and packaging structure, applied in the field of electronics, can solve the problems of cost waste, consumption of system chip 16 costs, etc., and achieve the effects of reducing cost, light weight, and increasing mechanical strength

Inactive Publication Date: 2009-04-29
台晶(宁波)电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, it should be noted that when the quartz crystal 20 is a defective product, it also consumes the cost of a system chip 16 at the same time, resulting in a waste of cost

Method used

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  • Quartz crystal oscillator encapsulation construction
  • Quartz crystal oscillator encapsulation construction
  • Quartz crystal oscillator encapsulation construction

Examples

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Embodiment Construction

[0021] Below in conjunction with specific embodiment, further illustrate the present invention. It should be understood that these examples are only used to illustrate the present invention and are not intended to limit the scope of the present invention. In addition, it should be understood that after reading the teachings of the present invention, those skilled in the art can make various changes or modifications to the present invention, and these equivalent forms also fall within the scope defined by the appended claims of the present application.

[0022] Such as figure 2 , 3 As shown, it is a perspective schematic view and a cross-sectional view of the quartz crystal oscillator of the present invention. As shown in the figure, the quartz crystal oscillator 30 of the present invention includes a rectangular package bottom layer 32 with external terminals on its bottom surface; a circuit layout layer 34 on the package bottom layer 32, which is divided into two non-overl...

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Abstract

The invention relates to a quartz crystal oscillator encapsulating structure, comprising an encapsulating bottom layer, a wire layout layer which is arranged on the encapsulating bottom layer and divided into a first area and a second area; the first area is provided with at least a hole; the second area is provided with a pair of buffer layers; the quartz crystal oscillator encapsulating structure also comprises a quartz crystal with two ends respectively fixed on the buffer layers, a system chip which is arranged in the hole, a supporting layer which is arranged along the buffer layer and the circumference of the wire layout layer, and a cover body which is arranged on the supporting layer. The quartz crystal oscillator encapsulating structure greatly reduces the dimension and weight of the quartz crystal by the buffer layers which have short separation distance and are arranged on the wire layout layer so as to lighten the weight of the quartz crystal oscillator and increase the anti-impact performance and to reduce the whole preparation cost, and is suitable for applied to a mobile electronic device.

Description

technical field [0001] The invention belongs to the field of electronic technology, in particular to an impact-resistant and low-cost quartz crystal oscillator. Background technique [0002] With the vigorous development of the electronic industry, the era of analog circuits has evolved into the era of sophisticated logic and digital circuits, and the sequential circuit, which is the heart of logic and digital circuits, has become an indispensable key component. In the sequential circuit, the quartz crystal oscillator is a necessary key component, and its applicable scope includes consumer products such as digital TV, game instruments, digital cameras, watches, information products such as computers, hard disks, mobile phones, wireless phones, etc. communication products, etc. Therefore, when various electronic products evolve with the needs of humanization, how to make the quartz crystal oscillator conform to the development trend and have better operation effect has becom...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H9/10H03H9/02
Inventor 姜健伟
Owner 台晶(宁波)电子有限公司
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