Unlock instant, AI-driven research and patent intelligence for your innovation.

Technical process for enhancing stability of NTC heat variable resistor

A technology of thermistor and process method, which is applied in the direction of resistors with negative temperature coefficients, etc., and can solve the problems of low stability of NTC thermistor ceramic chips

Inactive Publication Date: 2009-05-06
NANJING SHIHENG ELECTRONICS
View PDF1 Cites 19 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] The technical problem to be solved by the present invention is: aiming at the problem of low stability of the NTC thermistor ceramic chip produced above, a sintering production method that can significantly improve the stability of the NTC thermistor ceramic chip without reducing the product qualification rate is proposed. Process method

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Technical process for enhancing stability of NTC heat variable resistor
  • Technical process for enhancing stability of NTC heat variable resistor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] The specific steps of the process method for improving the stability of the NTC thermistor chip in the present preferred embodiment are as follows:

[0030] 1. Ingredients: Mix metal oxide powder manganese oxide, nickel oxide, iron oxide, aluminum oxide, and cobalt oxide evenly according to the following optimized weight ratio:

[0031] mn 3 o 4 :NiO:Fe 2 o 3 :Co 3 o 4 :Al 2 o 3 =56.48:14.48:19.04:6.65:3.35 (the conventional mixing percentage is: CuO:Mn 3 o 4 :NiO:Fe 2 o 3 :Al 2 o 3 :Co 3 o 4 =0~2.5%: 30~70%: 10~25%: 15~30%: 0.5~4.5%: 20~50%).

[0032] 2. Ball milling: put the uniformly mixed powder into the ball mill with water and grinding medium to make the powder into submicron particle fineness. Metal oxide powder: water: grinding media (zirconia balls) = 1:1:4 (weight ratio).

[0033] 3. Drying and pre-pressing molding: dry the powder after ball milling, and pre-press it into a molding ingot with a predetermined shape in the mold with a press.

...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a technique method for improving the stability of an NTC thermal resistor chip and belongs to the technical field of the manufacture technique of electronic devices. The technique method comprises the steps of mixing ingredients, ball milling, prepressing forming after drying, isostatic pressing, first sintering, slicing and second sintering. The NTC thermistor ceramic chip is sintered twice in two different process stages to eliminate internal non-equilibrium defects of the NTC thermistor ceramic chip caused by the stress action due to high temperature and machine tooling, and to speed up the stabilization process; meanwhile, a layer of compact sintered molten layer is formed on the surface of ceramic sheets to effectively eliminate the open pores. Thus the invention can significantly improve the stability of the NTC thermal resistor chip to solve the problems that the NTC thermal resistor chip has low stability and bad reliability.

Description

technical field [0001] The invention relates to a sintering manufacturing process for a ceramic electronic component chip, in particular to a process for improving the stability of an NTC thermistor chip, belonging to the technical field of electronic device manufacturing. Background technique [0002] At present, the conventional complete manufacturing process steps of NTC thermistor are as follows: [0003] 1. Ingredients: Mix various conventional metal oxide powders (mainly copper oxide, manganese oxide, nickel oxide, iron oxide, aluminum oxide, cobalt oxide) according to the required ratio. [0004] 2. Ball milling: put the prepared powder into the ball mill with water and grinding medium to make the powder into submicron particle fineness. [0005] 3. Drying and pre-pressing forming: dry the powder after ball milling, and pre-press it into the set shape in the mold with a press. [0006] 4. Isostatic pressing: Put the wrapped pre-pressed ingot into the isostatic cavit...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01C7/04
Inventor 汪洋
Owner NANJING SHIHENG ELECTRONICS