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A kind of NTC thermosensitive element semiconductor and preparation method thereof

A heat-sensitive element and semiconductor technology, which is applied in the field of NTC heat-sensitive element semiconductor and its preparation, can solve the problems of poor reliability and low stability, and achieve the effects of improving service life, improving stability, and eliminating internal imbalance defects

Active Publication Date: 2018-08-07
刘英
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  • Claims
  • Application Information

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Problems solved by technology

[0004] In order to solve the above problems, the object of the present invention is to provide a kind of NTC thermosensitive element semiconductor and preparation method thereof, adjust the proportioning of each component in the composition that is used for NTC thermosensitive element semiconductor and prolong the service life of resistance, gained NTC The secondary firing of thermal element semiconductors in two different process stages eliminates the internal imbalance defects caused by high temperature and machining stress during the manufacturing process of NTC thermal element semiconductors, accelerates the stabilization process and improves The service life of the semiconductor of the NTC thermal element is long, and at the same time, a dense sintered molten layer is formed on the surface of the ceramic sheet, which effectively eliminates the open pores, so the stability of the NTC thermal element can be significantly improved, and the problem of the NTC thermal element is solved. Problems of low stability and poor reliability

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  • A kind of NTC thermosensitive element semiconductor and preparation method thereof
  • A kind of NTC thermosensitive element semiconductor and preparation method thereof
  • A kind of NTC thermosensitive element semiconductor and preparation method thereof

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Embodiment Construction

[0022] In order to make the purpose, technical solution and advantages of the present invention clearer, the implementation manners of the present invention will be further described in detail below.

[0023] The preparation method of the NTC thermal element semiconductor of the present invention is as follows: mix manganese oxide, magnesium oxide and lanthanum oxide, add water after mixing evenly, grind for 40-60 hours, dehydrate and dry, add binder after dehydration, stir evenly, Obtain the powder; heat the obtained powder from room temperature to 1150~1250°C, and keep it warm for 3.5~7.5h; press the roasted powder in a mold to form a green sheet; heat the obtained green sheet at 1150~1250°C Roasting to obtain a ceramic sheet; coating silver paste on both sides of the ceramic sheet to make an electrode, and welding leads to obtain the semiconductor of the NTC thermal element.

[0024] The semiconductor composition of the NTC thermosensitive element of the embodiment of the p...

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Abstract

A semiconductor preparation method for an NTC thermosensitive element is as follows: mix manganese oxide, magnesium oxide and lanthanum oxide, add water after mixing evenly, grind for 40-60 hours, dehydrate and dry, add adhesive after dehydration, stir evenly, and form Powder; the powder is pressed into a mold, and the obtained green sheet is fired at 1150~1250°C to obtain a ceramic sheet; silver paste is coated on both sides of the ceramic sheet to make an electrode, and the lead wire is welded to obtain the NTC Thermosensitive element semiconductor. The method adjusts the ratio of each component in the composition used for NTC thermosensitive element semiconductor, prolongs the service life of the product, and solves the problems of low stability and poor reliability of the NTC thermosensitive element.

Description

technical field [0001] The invention belongs to the field of thermistors, and in particular relates to an NTC thermosensitive element semiconductor and a preparation method thereof. Background technique [0002] NTC is the abbreviation of Negative Temperature Coefficient, which means negative temperature coefficient, and generally refers to semiconductor materials or components with a large negative temperature coefficient. The so-called NTC thermal element is mainly made of metal oxides such as manganese, cobalt, nickel and copper. , Manufactured by electronic ceramic technology. These metal oxide materials all have semiconductor properties, because they are completely similar to semiconductor materials such as germanium and silicon in terms of conductivity. When the temperature is low, the number of carriers (electrons and holes) in these oxide materials is small, so its resistance value is high; as the temperature increases, the number of carriers increases, so the resis...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B35/50C04B35/01C04B35/04C04B35/622
Inventor 刘英
Owner 刘英