Wafer resistor element and manufacturing method thereof

Abstract

The invention relates to a wafer resistance element and a preparation method thereof; wherein, the wafer resistance element comprises a substrate, two positive electrodes which are arranged on the frontal surface of the substrate, two back electrodes which are arranged on the back surface of the substrate, a resistance layer which is arranged between the two back electrodes and provided with prearranged resistance, a protection film which coats the resistance layer and is isolated from the environment, two side electrodes which are respectively arranged on two side surfaces of the substrate and are electrically connected with the positive electrodes and the back electrodes at the same side respectively, and two layers of coatings which form three layers of coats from above the surfaces of the positive electrodes, the side electrodes and the back electrodes at the same side and comprise the main compositions of copper, nickel and tin. The invention also provides the method used for preparing the wafer resistance element. The wafer resistance element and the preparation method thereof take the copper, the nickel and the tin as main materials to form the coatings with simple preparation process, lead the element to be easily and correctly positioned on a soldering pad by liquid solder tin and to be bonded with the solder tin into a whole excellently, reduce the electron circulation path from the element to the soldering pad, and lead the element to have large power application and to provide precise micro-resistance values.

Description

technical field [0001] The invention relates to a passive element and its manufacturing method, in particular to a chip resistance element with micro-ohm (micro-Ω) level resistance and its manufacturing method. Background technique [0002] see figure 1 Shown is a cross-sectional view illustrating a conventional chip resistor element and its structure welded on a pad of a laminated circuit board. The chip resistance element is a passive element welded on a laminated circuit board 100 (PCB), and is used to provide a resistance value in the micro-ohm scale. The chip resistance element 1 includes a substrate 11 , two positive electrodes 12 , two back electrodes 13 , a resistive layer 14 , a protection layer 15 , two side electrodes 16 , and two plating layers 17 . [0003] The base material 11 is made of insulating material and is shaped like a rectangular plate. It has a back side 111 , two side surfaces 112 extending upwards from opposite sides of the back side 111 , and a ...

AI Technical Summary

Problems solved by technology

[0025] This shows that the above-mentioned existing chip resistance element and its manufacturing method obviously still have inconvenience and defects in product structure, manufacturing method and use, and need to be further improved urgently

In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and the general products and methods have no suitable structure and method to solve the above-mentioned problems. Obviously, it is a problem that relevant industry players are eager to solve.

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