Method for manufacturing package structure with reconfigured crystal particle by net-shaped structure

Abstract

The invention relates to an encapsulating structure for rearrangement of a crystal grain, which comprises the crystal grain which is provided with an active surface and a lower surface and is provided with plurality of welding pads on the active surface, an encapsulating body, a plurality of fan-out metal segments, a protective layer and a plurality of conductive components, wherein the encapsulating body is used for wrapping five surfaces of the crystal grain and exposing the plurality of the welding pads on the active surface of the crystal grain, one end of each of the plurality of the fan-out metal segments is electrically connected with the plurality of the welding pads, the protective layer is used for covering the active surface of the crystal grain and the plurality of the metal segments and exposing the upper surface at the other end of each metal segment, and the plurality of the conductive components are electrically connected with the other ends of the plurality of the metal segments.

Description

technical field [0001] The present invention relates to a packaging method for crystal grain reconfiguration, in particular to a packaging method for crystal grain reconfiguration by means of a network structure on a substrate. Background technique [0002] Semiconductor technology has developed quite rapidly, so the miniaturized semiconductor die (Dice) must have diversified functional requirements, so that the semiconductor die must be configured with more input / output pads ( I / O pads), so that the density of metal pins (pins) has also increased rapidly. Therefore, the early lead frame packaging technology is no longer suitable for high-density metal pins; therefore, a ball array (Ball Grid Array: BGA) packaging technology has been developed. The ball array package has the advantage of higher density than the lead frame package. In addition, its solder balls are less prone to damage and deformation. [0003] With the popularity of 3C products, such as: cell phone (CellPh...

AI Technical Summary

Problems solved by technology

The thinned die is redistributed on another substrate, and then a plurality of dies are formed into a package by injection molding; because the die is very thin, the encapsulant is also very thin, so when After the sealant is separated from the substrate, the stress of the sealant itself will cause the sealant to warp, increasing the difficulty of the subsequent cutting process

[0006] In addition, after the wafer is diced, when relocating the die on another substrate with a size larger than the original substrate, it is necessary to pick up the die through a pick & place device, and then place the die After flipping, the active surface of the die is attached to the substrate in a flip-chip manner, and in the process of flipping the die by the pick-and-place device, it is easy to generate tilt (tilt) and cause displacement, for example: tilt exceeding 5 microns, Therefore, the crystal grains will not be aligned, and then the alignment will not be possible in the subsequent ball planting process, resulting in a decrease in the reliability of the package structure.

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