Process for producing light-emitting device and light-emitting device
A technology of light-emitting device and manufacturing method, applied in the direction of electric components, circuits, electric solid-state devices, etc.
Inactive Publication Date: 2011-01-12
ASAHI GLASS CO LTD
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- Application Information
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Problems solved by technology
[0010] However, in the method of glass sealing using a metal mold as in Patent Document 1 and Patent Document 2, the pressure during molding deforms the electrode part of the LED, thereby bad situation
For example, in the structure in which the LED is connected to the wiring board through the protrusion, there are problems such as short circuit between the LED and the wiring board caused by the movement of the electrode or the damage of the protrusion
Method used
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Embodiment
[0209]
[0210] As the substrate, an alumina substrate with a purity of 99.6% and a thickness of 1 mm was used. Then, a gold paste for wiring formation was prepared. Specifically, gold (80% by weight) and organic varnish (18% by weight) were mixed, kneaded in a ceramic mortar for 1 hour, and dispersed three times with three rollers to obtain a gold paste.
[0211] As gold, spherical fine powder with an average particle diameter of 2 μm was used. In addition, as an organic varnish, a varnish obtained by dissolving an ethylcellulose resin having a degree of polymerization of 7 in α-terpineol to a concentration of 20% by weight was used.
[0212] Next, a gold paste is screen-printed on the surface of the alumina substrate to form a wiring pattern. Then, heat treatment was performed at 120° C. for 10 minutes, and then firing was performed at 800° C. for 30 minutes to form gold wiring on the alumina substrate.
[0213]
[0214] E1C60-0B011-03 (trade name) manufactured by T...
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Abstract
A process for manufacturing a light emitting device which can achieve high directivity with no cavity by minimizing occurrence of short circuit when a light emitting element is coated with glass. A light emitting device which can achieve high directivity with no cavity is also provided. After an LED mounted on a wiring board is provided, a glass member having a shape approximated by a rectangularparallelepiped or a sphere is mounted on the LED. Central axis of the glass member mounted on the LED is located in a region from the edge of the LED to an inside position with the central axis of the LED as the center, and the area of that region is set to be up to 90% of the entire surface for mounting the glass member. Thereafter, the glass member is softened by heat treatment to thereby coverthe LED with the glass member, thus forming a shape where the central axis of the LED is substantially aligned with the central axis of the glass member in a self-aligned manner.
Description
technical field [0001] The present invention relates to a method for manufacturing a light-emitting device and a light-emitting device, and more particularly to a method for manufacturing a light-emitting device and a light-emitting device in which a light-emitting element is covered with glass. Background technique [0002] Currently, a lighting device using a white light emitting diode (Light Emitting Diode, hereinafter referred to as LED) as a light emitting element is being put into practical use. The advantages of using white LEDs for lighting include: 1) Compared with incandescent lamps and fluorescent lamps, the power consumption is small and the running cost is low; 2) The trouble of replacement is eliminated due to the long service life; 3) Small size can be realized. 4) Harmful substances such as mercury in fluorescent lamps are not used. [0003] A general white LED has a structure in which the LED is sealed with resin. For example, in a typical monolithic white...
Claims
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IPC IPC(8): H01L33/00C03C3/14H01L33/54H01L33/56H01L33/58
CPCC03C3/155H01L33/58H01L33/56C03C3/253H01L33/54H01L24/05H01L2224/05568H01L2224/05573H01L2224/05644H01L2224/13H01L2224/16225H01L2224/45144H01L2224/48247H01L2924/181H01L2924/00014H01L2924/00012H01L2924/00
Inventor 中村伸宏松本修治
Owner ASAHI GLASS CO LTD