Backing material, ultrasonic probe, ultrasonic endoscope, ultrasonic diagnostic device, and ultrasonic endoscope device

An ultrasonic and endoscope technology, applied in the directions of sonic diagnosis, ultrasonic/sonic/infrasonic diagnosis, infrasonic diagnosis, etc., can solve the problems of low pass rate, high peak temperature, and little improvement of radiation efficiency, so as to suppress the surface temperature. rising effect

An ultrasonic and endoscope technology, applied in the directions of sonic diagnosis, ultrasonic/sonic/infrasonic diagnosis, infrasonic diagnosis, etc., can solve the problems of low pass rate, high peak temperature, and little improvement of radiation efficiency, so as to suppress the surface temperature. rising effect

CN101444430AInactive Publication Date: 2009-06-03FUJIFILM CORP
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  • Backing material, ultrasonic probe, ultrasonic endoscope, ultrasonic diagnostic device, and ultrasonic endoscope device
  • Backing material, ultrasonic probe, ultrasonic endoscope, ultrasonic diagnostic device, and ultrasonic endoscope device
  • Backing material, ultrasonic probe, ultrasonic endoscope, ultrasonic diagnostic device, and ultrasonic endoscope device

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[0049] Figure 3A Is a plan view of the backing material in the ultrasonic probe according to the first embodiment of the present invention, and Figure 3B It is a perspective view of the backing material in the ultrasonic probe according to the first embodiment of the present invention. In the first embodiment of the present invention, the backing material 1 includes: a backing base material 11 that has electrical insulation properties; and a thermally conductive fiber 12 that is disposed in the backing base material 11 and has electrical insulation properties. Here, the thermally conductive fiber 12 has higher thermal conductivity than the backing base material 11.

[0050] Such as Figure 3B As shown in the figure, the thermally conductive fiber 12 penetrates from the first surface of the backing material 1 which is in contact with the plurality of piezoelectric vibrators (vibrator array) to the second surface different from the first surface of the backing material 1 without ...

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Abstract

A backing material for suppressing the surface temperature rise of an ultrasonic probe. This backing material is provided on a back face of at least one vibrator for transmitting and / or receiving ultrasonic waves in an ultrasonic probe, and includes: a backing base material containing a polymeric material; and a heat conducting fiber provided in the backing base material, having a larger coefficient of thermal conductivity than that of the backing base material, and running through without disconnection from a first face of the backing material in contact with the at least one vibrator to a second face different from the first face.

Description

Technical field [0001] The present invention relates to a backing material to be used in an ultrasonic probe, which is used to transmit and receive ultrasonic waves. Furthermore, the present invention relates to an ultrasound probe used when performing intracavity scanning or extracavity scanning for an object to be inspected, and an ultrasound endoscope used by being inserted into the body cavity of the object, each of which includes such a backing material. Moreover, the present invention relates to an ultrasonic diagnostic apparatus or an ultrasonic endoscope apparatus, which includes such an ultrasonic probe or an ultrasonic endoscope and a main body unit. Background technique [0002] In the medical field, various imaging techniques have been developed in order to observe the inside of an object to be inspected and make a diagnosis. In particular, ultrasound imaging, which acquires internal information of an object by transmitting and receiving ultrasound, enables real-time ...

Claims

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Application Information

Patent Timeline
03 Jun 2009
Publication
CN101444430A
IPC
A61B8/12; A61B8/00
CPC
A61B8/4488; A61B8/4455; A61B8/12; A61B8/445
Inventors
日向浩彰