Backing material, ultrasonic probe, ultrasonic endoscope, ultrasonic diagnostic device, and ultrasonic endoscope device
An ultrasonic and endoscope technology, applied in the directions of sonic diagnosis, ultrasonic/sonic/infrasonic diagnosis, infrasonic diagnosis, etc., can solve the problems of low pass rate, high peak temperature, and little improvement of radiation efficiency, so as to suppress the surface temperature. rising effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
no. 1 example
[0049] Figure 3A Is a plan view of the backing material in the ultrasonic probe according to the first embodiment of the present invention, and Figure 3B It is a perspective view of the backing material in the ultrasonic probe according to the first embodiment of the present invention. In the first embodiment of the present invention, the backing material 1 includes: a backing base material 11 that has electrical insulation properties; and a thermally conductive fiber 12 that is disposed in the backing base material 11 and has electrical insulation properties. Here, the thermally conductive fiber 12 has higher thermal conductivity than the backing base material 11.
[0050] Such as Figure 3B As shown in the figure, the thermally conductive fiber 12 penetrates from the first surface of the backing material 1 which is in contact with the plurality of piezoelectric vibrators (vibrator array) to the second surface different from the first surface of the backing material 1 without ...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com