Die-forming process of bamboo particles used for packaging materials and die for hot-press forming thereby

Abstract

The invention relates to a die-forming process of bamboo particles used for packaging materials and a die therefor. The process involves a step as follows: puncturing the crusts of a plate blank onceor repeatedly during the hot-press forming procedure, so as to release the gases inside the plate blank. The die comprises a needle-pushing mechanism arranged on a lower die. The needle-pushing mechanism comprises needles, a pusher and an operating mechanism. One or more through-holes are formed on the lower die and perpendicular to the die-closing surface of the die. One needle is vertically inserted in each through-hole. The pusher is arranged under the needles in the position close to the needles. The operating mechanism is in the linkage with the up-and-down slippage of the needles via thepusher. The needles each are provided with a first position of extending out of the through-hole to punch the plate blank and a second position of retuning to the through-hole. The die-forming process adopts the needles to punch the plate blank during the hot-press forming procedure, so as to release the gases inside the plate blank and reduce the internal moisture inside the plate blank. The dieis designed based on the prior die with the addition of the needle-pushing mechanism which punches the plate blank during the hot-press forming procedure, thereby ensuring that the work's operation is simple and easy to carry out.

Description

technical field [0001] The invention relates to the field of packaging products, in particular to a molding production process of bamboo scraps used for packaging materials and a mold for hot-pressing molding used in the process. Background technique [0002] In the past ten years, the research and production of bamboo processing and utilization in my country have developed rapidly. At present, there are hundreds of factories producing various kinds of bamboo plywood, bamboo mats, bamboo parquet floors, bamboo sanitary chopsticks and other bamboo processing enterprises. The high utilization ratio can only reach about 40%, and the low one is only 20-30%. New avenues of utilization need to be investigated. Even if some manufacturers want to use bamboo, the processing residues of bamboo chopsticks factories and a large number of fast-growing materials to develop products such as inner packaging liners for electromechanical products and industrial trays, it is difficult to solve ...

AI Technical Summary

Problems solved by technology

Even if some manufacturers want to use bamboo, the processing residues of bamboo chopsticks factories and a large number of fast-growing materials to develop products such as inner packaging liners for electromechanical products and industrial trays, it is difficult to solve the long-standing problems in the hot-pressing process.

Because the moisture content of the bamboo particle board is difficult to control during the hot pressing process, the low moisture content reduces the adhesive strength of the glue, which reduces the bonding strength in the slab, and it is easy to cause burrs on the surface of the slab. It not only prolongs the hot-pressing time and reduces production efficiency, but more importantly, the moisture in the slab turns into high-pressure water vapor during the hot-pressing process and remains in the slab, which can easily lead to bubbling and hollow delamination of the slab, seriously affect the quality of the board

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