Spiral inductor structure, fabricating method and packing structure thereof

A technology of spiral inductors and packaging structures, applied in the manufacture of inductors/transformers/magnets, inductors, printed inductors, etc., can solve problems such as low quality factor and difficult preparation, and achieve the effect of improving the quality factor

Inactive Publication Date: 2009-06-03
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional inductors have a low quality factor due to the need for sufficient device space and the difficulty in manufacturing due to the complex coil structure of the inductor

Method used

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  • Spiral inductor structure, fabricating method and packing structure thereof
  • Spiral inductor structure, fabricating method and packing structure thereof
  • Spiral inductor structure, fabricating method and packing structure thereof

Examples

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Embodiment Construction

[0038] The present invention has been disclosed in the following specification with several preferred embodiments, but it is not intended to limit the present invention, and any person skilled in the art should be able to make arbitrary changes without departing from the spirit and scope of the present invention. Move and modify. In some instances, well-known structures and processes have not been described in detail in order to avoid obscuring the present invention.

[0039] In the reference examples in the specification, "an embodiment" or "an embodiment" means a specific pattern, structure or feature in at least one embodiment of the present invention. Thus, terms that appear in the specification, such as "one embodiment" or "one embodiment," do not necessarily all refer to the same embodiment. Furthermore, special patterns, structures or features may be combined in any suitable manner in one or more embodiments. The following figures are not drawn to scale and are for il...

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Abstract

The present invention provides a spiral inductor structure, a method for fabricating an inductor structure and packing structure thereof. In one embodiment, a substrate is provided over which a spirally patterned conductor layer is formed to produce a planar spiral inductor. A via hole is formed in the substrate within the spirally patterned conductor layer, the via hole being formed by through silicon via (TSV). Thereafter, the via hole is filled with a core layer, wherein the core layer extends from a bottom surface of the substrate to a top surface thereof. The present invention may improve quality factor of the spiral inductor structure and integrate the same onto the IC chip.

Description

technical field [0001] The invention relates to a preparation method of a general spiral inductor structure, and in particular to a preparation method of a spiral inductor structure with a high quality factor (Q), a spiral inductor structure, and a package device using the inductor structure as a package element. Background technique [0002] An inductor is an impedance device, typically consisting of a coil, and may have a core, that imparts an inductive value to an electronic circuit. Both transformers and inductive reactors are inductors. Various inductors are covered by core materials (such as ferrous salts) to form a shape like a coil. The inductance of the existing coil can be increased by the permeability of the core material. The core generally exists in the shape of strips or rings. In order to obtain a high inductance value, the coil is generally wound many times. Winding the coil around a closed iron loop or a ferrous core can increase the inductance. In orde...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F17/00H01F41/00
CPCH01F2017/0073H01F17/0013H01F2017/0046H01L2924/3011H01L28/10H01F2017/0086H01F2017/002H01L23/5227H01L2924/0002H01L2924/00
Inventor 张仕承李惠宇
Owner TAIWAN SEMICON MFG CO LTD
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