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Led light source unit

An LED light source and light emitting diode technology, applied in the field of light emitting diode light source units, can solve the problems of increasing the thickness of the substrate, unable to bend the LED mounting part arbitrarily, and unable to use it, so as to reduce the temperature rise of the LED, suppress the low luminous efficiency, and prevent the LED the effect of damage

Active Publication Date: 2009-06-10
DENKA CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is necessary to increase the thickness of the substrate, and the size punched out from electrodes and wiring patterns is larger than that of a printed circuit board, and there is a problem that the substrate area becomes larger.
In addition, since the part other than the LED mount cannot be bent arbitrarily, the formation position of the input terminal is restricted.
[0012] In addition, if the thickness of the metal base plate of the aforementioned metal base circuit board is reduced to form a small-sized structure punched out from electrodes and wiring patterns, etc., as in the printed board, then similar to the printed board formed with via holes, the Considering the heat dissipation from the back of the metal base plate to the front of the case, when the LED is continuously lit, there is a problem that the luminous efficiency of the LED itself decreases due to an increase in the temperature of the LED.
In addition, even if the metal base circuit board is slightly bent, the insulating layer will be cracked and cannot be used. In addition, there are problems such as that the LED mounting part cannot be bent arbitrarily.

Method used

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  • Led light source unit
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0101] made figure 1 LED light source unit of the type shown. That is to say, for a printed circuit board with glass cloth in which 35 μm thick copper foil is formed on both sides of a 100 μm thick epoxy resin cloth impregnated with a glass substrate, at a predetermined position (the conductor connected to the electrode terminal 1a of the LED) The position where the circuit is connected to the back conductor circuit located below it) forms a via hole, and after copper plating, forms a conductor circuit for mounting LEDs, and a back conductor circuit for lighting and heat dissipation of the LED, and makes a printed circuit board.

[0102] 10% by mass of acrylic acid ( Toagosei Co., Ltd., "AA"), 0.5% by mass of photopolymerization initiator 2,2-dimethoxyl,2-diphenylethan-1-one (Seba special Chemical Co., Ltd.), 0.2% by mass of triethylene glycol dithiol (manufactured by Maruzen Chemical Co., Ltd.), and 0.2% by mass of 2-butyl-2-ethyl-1,3-propanediol diacrylate (by Kyoeisha Che...

Embodiment 2

[0129] An LED light source unit was fabricated in the same manner as in Example 1 except for the following points. That is, as the inorganic filler, alumina ("DAW-10", manufactured by Denki Kagaku Kogyo Co., Ltd.) was classified with a 45 μm sieve, and inorganic filler A having a maximum particle size of 45 μm or less and an average particle size of 9 μm was used. Then, 40 volume % of the inorganic filler A, 45 volume % of the resin composition A, and 15 volume % of the resin composition B were mixed and mixed, and the resin composition D was obtained.

[0130] Then, the resin composition D that has been subjected to defoaming treatment is coated on a PET film with a surface of 75 μm in thickness, and the PET film with a release treatment on the surface is further covered. 3000mJ / cm 2 UV rays with a wavelength of 365nm are irradiated. Thereafter, the resin composition D was cured by heat-processing at 100° C. for 3 hours to obtain an electrically insulating and heat-conducti...

Embodiment 3

[0134] An LED light source unit was fabricated in the same manner as in Example 1 except for the following points.

[0135] That is, using the same resin composition D as that used in Example 2, the resin composition D after the defoaming treatment was applied to a thickness of 46 μm on a PET film with a surface thickness of 75 μm and subjected to a release treatment, and A glass cloth with a thickness of 50 μm was laminated on the upper layer, and a PET film whose surface was subjected to a mold release treatment was further covered thereon, and the resin composition D was impregnated in the glass cloth by lamination.

[0136] Then, from the front and back at 3000mJ / cm 2 UV rays with a wavelength of 365nm are irradiated. Thereafter, the resin composition D was cured by heat-processing at 100° C. for 3 hours to obtain an electrically insulating and heat-conductive adhesive tape with a thickness of 150 μm.

[0137] Then, a solder paste (manufactured by Senju Metal Co., Ltd., ...

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PUM

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Abstract

To provide an LED light source unit which is excellent in heat dissipation performance, able to prevent damage to LED and bright, and which has a long life. An LED light source unit comprising a printed board, at least one light emitting diode provided on the printed board, and an adhesive tape for fixing the printed board on the surface of a heat dissipating member, wherein the thermal conductivity of the adhesive tape is from 1 to 4 W / mK, and the withstand voltage between the fixing face of the printed board and the fixing face of the heat dissipating member is at least 1.0 kV.

Description

technical field [0001] The invention relates to a light emitting diode (LED) light source unit, which uses a light emitting diode (LED) as a light source, and has excellent heat dissipation and long life. Background technique [0002] In a liquid crystal display device or the like composed of a liquid crystal display part and a backlight, a small fluorescent tube called a CFL (cold cathode tube) is generally used as a light source of the backlight. [0003] The light source of the aforementioned CFL (cold cathode tube) adopts the following structure: Hg (mercury) is sealed in the discharge tube, and the mercury excited by the discharge emits ultraviolet rays to the fluorescent substance on the tube wall of the CFL (cold cathode tube), and converts it into visible light . Therefore, recently, an alternative light source that does not use harmful mercury has been demanded in consideration of environmental aspects. [0004] Recently, an LED light source unit using a light emi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00F21V29/00F21Y101/02F21K99/00H01L33/48H01L33/64
CPCF21K9/00H05K1/056H05K3/386H05K2201/10106H05K2203/0191H05K3/0061F21Y2101/02H05K1/0203H05K1/0206H05K2201/0209F21Y2115/10
Inventor 冈岛芳彦八岛克宪光永敏胜冈田拓也
Owner DENKA CO LTD
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