Liquid phase sintering method of spray forming aluminium silicon electronic packing material

An electronic packaging material, a technology of silicon-aluminum alloy, applied in the field of functional materials, can solve the problems of difficulty in preparing silicon-aluminum alloy, application limitations of silicon-aluminum alloy, and the inability of silicon-aluminum alloy to be used in electronic packaging, etc., and achieve low thermal expansion coefficient, low The effect of density, tissue compaction

Inactive Publication Date: 2009-06-24
GENERAL RESEARCH INSTITUTE FOR NONFERROUS METALS BEIJNG
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AI Technical Summary

Problems solved by technology

[0003] The silicon phase in silicon-aluminum alloy materials prepared by traditional casting methods mostly exists in the shape of thick laths, and the anisotropy of the material is very obvious. Moreover, the coarse primary silicon phase will cause mechanical brittleness of the material, which makes the application of silicon-aluminum alloys restricted. restrictions, so the silicon-aluminum alloy prepared by this method cannot be used as an electronic package
Si-aluminium alloys with a silicon content below 50% (mass fraction) produced by powder metallurgy after atomization powder milling have a fine structure and a dispersed distribution of silicon phases. Silicon aluminum alloy

Method used

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  • Liquid phase sintering method of spray forming aluminium silicon electronic packing material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036]First prepare the spray-formed high-silicon aluminum alloy deposition blank: under a nitrogen protective atmosphere, add 24kg of industrial pure silicon to 16kg of industrial pure aluminum after medium-frequency induction melting, raise the temperature to 1400°C, and let it stand for 10 minutes after the silicon is completely melted, the temperature is 1400°C The alloy melt flows through the tundish and the guide tube, and the temperature of the tundish and the guide tube is controlled at 1350 ° C ~ 1450 ° C, and the billet is sprayed and formed. Double-layer unrestricted airflow atomizing nozzles are used. The atomizing nozzles are Frequency (1~5) Hz for scanning, the atomizing gas is nitrogen, the method of cooperation between the atomizing nozzle and the deposition blank is a direct injection cable-drawing method, the cable-drawing angle is 35°, the eccentricity is 30mm, and the atomization distance is 500 ~600mm, using a silicon nitride guide tube, the hole diameter a...

Embodiment 2

[0039] 20kg50Si50Al (that is, the silicon content is 50wt%, and the aluminum content is 50wt%) alloy is smelted, and 13.33kg of industrial pure silicon is added, and spray-molded to prepare a 70Si30Al alloy (that is, the silicon content is 70wt%, and the aluminum content is 30wt%), and the preparation parameters are the same as the examples 1. Take a sample of Φ21.5×50mm from the deposition blank, evenly smear a layer of graphite powder on the surface as a lubricant, put it into a 45# steel mold of Φ53×Φ21.7×100mm, add one at each end of the sample The high-strength graphite gasket of Φ21.6×15mm is sintered at 580°C and 260MPa for 2h in an air atmosphere after being kept at 580°C for 0.5h. After sintering and cooling naturally, the obtained electronic packaging material has a density of 2.421×10 3 kg·m -3 , the flexural strength is 180MPa, and the coefficient of thermal expansion at room temperature is 8.8.

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Abstract

The invention relates to a liquid-phase sintering method for a silumin electronic encapsulating material through spray molding. A spray molding method is adopted to prepare the silumin electronic packaging material; the silicon content of silumin is between 50 and 70 weight percent and the balance being aluminum; a deposited blank of the sprayed and molded silumin is subjected to scalping and surfacing, is added with boron nitride powder or graphite powder as a lubricant, is kept at a temperature of between 570 and 590 DEG C for half an hour and is kept at a pressure of between 220 and 300 MPa for 2 hours to obtain the electronic encapsulating material with density of between 2.4 and 2.6*10<3>kg.m<-3>, thermal expansion coefficient of between 7.4 and 17 and bending strength of between 180 and 240 MPa. The method adopts silumin material through spray molding to obtain mechanical performance close to that of a hot isostatic pressing similar material within the range of low sintering temperature and wide sintering pressure, and has no special requirement on equipment simultaneously; therefore, the method has simple process steps and is suitable for industrialized production.

Description

technical field [0001] The invention relates to a low-temperature liquid-phase sintering method for a spray-formed high-silicon aluminum alloy electronic packaging material, which belongs to the field of functional materials. Background technique [0002] The development of modern science and technology has increasingly high requirements on materials. In the field of electronic packaging, with the increasing complexity and density of components in electronic devices and electronic devices, the development of electronic packaging materials with excellent performance and meeting various requirements has become It is imperative. Thermal expansion coefficient, thermal conductivity and specific gravity are the three basic elements that must be considered in the development of modern electronic packaging materials. Only materials that fully take into account these three basic requirements and have reasonable packaging process performance can meet the requirements of the developme...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F3/00
Inventor 刘红伟张永安朱宝宏王锋熊柏青
Owner GENERAL RESEARCH INSTITUTE FOR NONFERROUS METALS BEIJNG
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