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Test method and system

A test method and test procedure technology, applied in the field of electronics, can solve the problems of increased packaging cost, low fault coverage, complicated implementation process, etc., and achieve the effect of reducing the number of pins, ensuring product quality, and comprehensively testing

Inactive Publication Date: 2012-04-18
新奇点智能科技集团有限公司
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Problems solved by technology

[0004]But both test methods will have certain problems in practical application, for example: for the first test method, it will add extremely complicated radio frequency (RF, Radio Frequency) test (SIP usually includes a chip for processing radio frequency signals, the test of this chip has very high requirements for test equipment and test environment, etc., and the implementation process is very complicated), it is difficult to implement, and it will increase the package pin ( pin), thereby increasing the packaging cost; for the second test method, although the above-mentioned problems will not exist, because the fault coverage is too low, it is easy to provide bad chips to customers

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Embodiment Construction

[0055] In this step, the test signal received by the DUT may be from the ATE or from a radio frequency source (RF Source). That is: when the power-on time of the DUT reaches the first predetermined time, such as 110ms, the ATE sends a trigger signal (Trigger Signal) to the RF Source, and the RF Source sends the trigger signal to the DUT after receiving the trigger signal. slot (that is, including at least 4 time slots), the RF signal is the test signal; or, it is also possible not to set the RF Source, but when the power-on time of the DUT reaches the first predetermined time, the ATE directly sends the test signal to the The DUT transmits an RF signal consisting of more than 4 time slots.

[0056] The DUT performs down-conversion and analog-to-digital conversion processing on the received RF signal, and performs synchronization according to the processed signal. If the synchronization is successful, it further performs decoding and error correction processing, and outputs pre...

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Abstract

The invention discloses a testing method which comprises the following steps: acquiring the testing procedure from automatic test equipment (ATE) by using a device under test (DUT) and initializing according to the testing procedure; receiving test signals by using the DUT, and testing according the test signals, and outputting test results; and reading the test results by using the ATE and determining whether the DUT conforms to the requirements according to the test results. The invention simultaneously discloses a testing system. By applying the method and the system, the test cost can be reduced, the fault coverage can be improved, and the invention can be implemented easily.

Description

technical field [0001] The invention relates to electronic technology, in particular to a chip testing method and system. Background technique [0002] The characteristics of low cost, small area, high frequency and high speed, and short production cycle make the demand for system-in-package (SIP, System in a Packet) increase day by day, and gradually become a mainstream product packaging form. The SIP mentioned here refers to the integration of multiple functional chips in one package, so as to realize a basically complete function. [0003] In order to ensure product quality, it is necessary to test the encapsulated SIP. At present, the test methods of various manufacturers are basically confidential. The known test methods mainly include the following two types: separate tests for each chip in the SIP and only test connectivity and leakage current. [0004] However, these two test methods will have certain problems in practical applications. For example, for the first t...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/28
Inventor 张辉王西强苏占峰刘永元张炎杨浴光
Owner 新奇点智能科技集团有限公司