Combined structure and method of radiator and circuit

A heat sink and circuit technology, applied in the direction of circuits, electrical components, electric solid devices, etc., can solve problems such as heat dissipation of electronic components

Inactive Publication Date: 2009-07-01
AMA PRECISION INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] One object of the present invention is to solve the problem of heat dissipation of electronic components, wherein the present invention provides a combination structure and method of a heat sink and a circuit, so that the circuit or electronic components can be closer to the heat sink to increase heat dissipation efficiency

Method used

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  • Combined structure and method of radiator and circuit
  • Combined structure and method of radiator and circuit
  • Combined structure and method of radiator and circuit

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Embodiment Construction

[0027] It is known that in the combination of aluminum substrate and light-emitting diode, the aluminum substrate is stamped and cut in the form of pure aluminum A1100 or A1050, and the combination method is mostly made individually, and then locked and connected one by one with fixing elements such as screws. . Not only does it require a lot of manpower for assembly, but also there is a cost problem of fixing components such as screws, which greatly reduces its practicability and economic benefits.

[0028] The technical content of the present invention will be described in detail below in conjunction with the accompanying drawings, but the accompanying drawings are only for reference and description, and are not intended to limit the present invention.

[0029] Please refer to Figure 1-4 As shown, according to a method for combining a heat sink and a circuit provided by the present invention, the method includes the following steps:

[0030] First, paste a first insulatin...

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PUM

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Abstract

The invention relates to a combination structure of a heat radiator and a circuit, as well as a combination method thereof. The structure comprises an extrusion-type aluminum-base plate, a first insulating layer, a conducting layer, a second insulating layer and an electronic element, wherein, the extrusion-type aluminum-base plate is covered with the first insulating layer; the conducting layer is wired on the first insulating layer and provided with a conducting wire and a plurality of guidance and connection points; the conducting wire is covered with the second insulating layer; the electronic element is provided with two conducting terminals; and the two conducting terminals are electrically connected with each guidance and connection point respectively. In addition, the invention further provides the method for combining the heat radiator and the circuit. Therefore, the invention can not only shorten process time and save the element consumption, thereby reducing the cost, but also increase the thermal conduction efficiency and improve the radiating efficiency.

Description

technical field [0001] The invention relates to a combination structure, in particular to a combination structure and a combination method of a radiator and a circuit. Background technique [0002] Since light emitting diodes (LEDs) have many advantages such as good brightness, long life, and more power saving, they have been widely used by manufacturers in indoor or outdoor lighting structures or devices. However, how to reduce the production cost and greatly reduce the use of components, so that the lighting device can be widely accepted and adopted by the public at a relatively low price is an important subject of the present invention. [0003] In the existing light-emitting diode, as disclosed in the Chinese invention patent application with publication number CN1893122A, two installation holes are provided on a substrate, and a diode chip is fixed above the substrate at the interval between the two installation holes. The diode chip and the base plate are insulated by...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/34F21V29/00
Inventor 陈国星林暄智
Owner AMA PRECISION INC
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