Circuit substrate capable of opening slots

Abstract

The invention discloses a slottable circuit substrate, mainly comprising a substrate body having a slotting region, a plurality of jointing fingers, an electroplating busbar frame and a plurality of electroplating connecting wires all provided at a lower surface of the substrate body. The jointing fingers are located in vicinity of the outside of the slotting region, the electroplating busbar frame is located within the slotting region, the electroplating connecting wires connect the jointing fingers to the electroplating busbar frame; wherein, the electroplating busbar frame is more adjacentto the edge of the slotting region than the jointing fingers. Therefore, the length of the electroplating connecting wire within the slotting region is shortened to obtain preferable cutting support so as to avoid the cutting burr and displacement resulted from the electroplating connecting wires that remain on the substrate at the time of the slotting. Furthermore, currents can be divided equallyin a manner of parallel connection to ameliorate the quality of the electroplating on the surfaces of the jointing fingers.

Description

technical field [0001] The invention relates to a printed circuit board, in particular to a grooveable circuit substrate (substrate), which is suitable for window-type semiconductor packaging. Background technique [0002] Window Ball Grid Array (WBGA) is a common semiconductor device, which uses a circuit substrate with punched holes as a chip carrier. Usually, the upper surface of the substrate is used to carry semiconductor chips and other components. The lower surface of the substrate is used to join external terminals such as solder balls. The lower surface of the substrate is also provided with fingers, and a plurality of bonding wires are formed by wire bonding technology, and the chip is electrically connected to the substrate through the wire bonding slots. the fingers. [0003] see figure 1 As shown, an existing window type BGA package structure uses a substrate 100 as a chip carrier. The substrate 100 mainly includes a substrate body 110 , a plurality of finger...

AI Technical Summary

Problems solved by technology

Therefore, the current density during electroplating cannot be evenly distributed to each electroplating connection line 140, which will cause the electroplating thickness on the surface of each finger 120 to be different, thus resulting in poor electroplating quality.

[0006] It can be seen that the above-mentioned existing window-type ball grid array packaging structure obviously still has inconvenience and defects in structure and use, and needs to be further improved urgently.

In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and the general products do not have a suitable structure to solve the above-mentioned problems. This is obviously related. The problem that the industry is eager to solve

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