Reactive hot-melt composition and molded article using the same

A composition and reactive technology, applied in the field of reactive hot melt compositions, can solve the problems of insufficient development, insufficient shortening of molding cycle, time-consuming cooling and solidification, etc.

Inactive Publication Date: 2009-08-05
UBE IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the conventional moisture-curable polyurethane hot-melt material has the problem that it takes time to cool and solidify in the mold, and the molding cycle cannot be shortened sufficiently.
In addition, most conventional hot-melt materials are aimed at integrating electrical and electronic components, and the development of reactive hot-melt compositions with strong adhesion to metals such as aluminum is insufficient.

Method used

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  • Reactive hot-melt composition and molded article using the same
  • Reactive hot-melt composition and molded article using the same
  • Reactive hot-melt composition and molded article using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0109] Embodiment 1 (manufacture of reactive hot melt composition)

[0110] 60 parts by mass of crystalline polyester polyol (manufactured by Ube Industries, Ltd., ETERNACOLL (registered trademark) 3010) and 15 parts by mass of amorphous polyester polyol (manufactured by Ube Industries, Ltd., ETERNACOLL (registered trademark) 5011) 25 parts by mass of polycarbonate polyol (manufactured by Ube Industries, Ltd., UH-CARB (registered trademark) 100) were put into a separable flask, replaced with nitrogen, and heated and melted at 120°C. Furthermore, while stirring at a rotation speed of 250 rpm, dehydration treatment was carried out at 120° C. and 50 mmHg for 1 hour, and nitrogen substitution was performed for 10 minutes. Then, the polyol mixture was cooled to 80° C., 1 part by mass of carbon black masterbatch (manufactured by Sumikacolor Co., Ltd., burak SHPA-817, carbon black content: 40%) was added, and stirred and mixed at 150 rpm for 1 hour. Add 4,4'-diphenylmethane diisocya...

Embodiment 2～14 and comparative example 1～3

[0130] Examples 2-14 and Comparative Examples 1-3 (manufacture of reactive hot-melt composition)

[0131] Except having performed the compounding shown in Table 2 instead of the compounding recipe of Example 1, each component was compounded similarly to Example 1, and it processed similarly, and the reactive hot-melt composition was obtained. The results are shown in Table 2 and Table 3.

[0132]

[0133]

[0134] As can be seen from Table 3, the reactive hot-melt composition of the present invention shown in the examples is compared with the composition of Comparative Examples 1-3, there is no big difference in melting point, crystallization temperature, viscosity, but because the half-crystallization time is in Less than 150 seconds, so the cooling and solidification time is shortened to less than 40 seconds, which can shorten the molding cycle. In addition, since the heat of crystallization (ΔH) is in the range of 30 to 80 J / g, especially 30 to 75 J / g, the formabilit...

Embodiment 15

[0135] Example 15 (manufacture of molded article integrating printed circuit board)

[0136] Using the reactive hot-melt composition obtained in Example 1, a molded article into which a printed circuit board was inserted was produced in the following procedure.

[0137] (1) The reactive hot-melt composition was added to a gear pump type glue applicator (set at 120°C for the tank, 120°C for the hose, and 120°C for the nozzle), and melted at 120°C.

[0138] (2) Prepare a mold that can obtain a flat molded product with a length of 50 mm, a width of 30 mm, and a thickness of 4 mm. After applying a release agent, use a support pin to place a printed circuit with a length of 45 mm, a width of 25 mm, and a thickness of 1 mm. The substrate is set in the mold so as to be arranged in the center of the molded product.

[0139] (3) Connect the nozzle of the glue applicator to the injection tank of the mold in a manner that does not leak pressure. Under the conditions of a processing temp...

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Abstract

Disclosed is (1) a reactive hot-melt composition which enables the molding cycle to be curtailed and has excellent adhesion to a metal such as aluminum or the like. Specifically disclosed are: (1) a reactive hot-melt composition which can be produced by reacting a composition comprising a crystalline polyester polyol and a non-crystalline polyester polyol with a polyisocyanate, and which has a semicrystallization time of 150 seconds or shorter as measured by a differential thermal analysis method and a heat of crystallization of 30 to 90 J / g; (2) a reactive hot-melt composition which can be produced by reacting a composition comprising 100 parts by mass of a polyol comprising 30 to 95% by mass of a crystalline polyester polyol and 5 to 70% by mass of a non-crystalline polyester polyol and 0.05 to 5 parts by mass of a nucleating agent with a polyisocyanate; and (3) a molded article produced by molding any one of the above-mentioned compositions.

Description

technical field [0001] The present invention relates to a reactive hot-melt composition that can shorten the molding cycle and has excellent adhesion to metals and the like, and a molded article using the composition. Background technique [0002] In recent years, the so-called "hot-melt molding" molding method of injecting a hot-melt material into a mold to obtain a molded product has been used for sealing electric and electronic parts and the like. Polyamide resins (see Patent Document 1) and polyester resins (see Patent Document 2) are known as molding materials for hot-melt molding, but these materials are thermoplastic materials and have poor heat resistance and mechanical properties of molded products. And other issues. [0003] On the other hand, among hot-melt materials, there is a reactive hot-melt material that has isocyanate or silane at the molecular end, and is made high in molecular weight and cross-linked by reacting with moisture in the air after the manufac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G18/48
CPCC08G18/4825C08G18/4854C08G18/4216C08G18/4238C08G2250/00C08G18/4018C08G18/10C08G18/4202C08G2170/20C08G18/44C08G18/307
Inventor 市桥秀树金子孝芳
Owner UBE IND LTD
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