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Partial plating method, laser plating equipment and plating member

A technology of local electroplating and electroplating equipment, applied in laser parts, lasers, electrical components, etc., can solve the problem of increasing the cost of production parts, and achieve the effect of continuous transmission

Inactive Publication Date: 2009-08-05
AUTONETWORKS TECH LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this form, plating on areas other than those that need to be plated results in an increase in the cost of producing the part due to the high price of precious metals

Method used

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  • Partial plating method, laser plating equipment and plating member
  • Partial plating method, laser plating equipment and plating member
  • Partial plating method, laser plating equipment and plating member

Examples

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Embodiment Construction

[0073] A partial plating method according to the present invention will now be described in detail with reference to the accompanying drawings.

[0074] The partial plating method according to the present invention uses a laser beam having a wavelength of 330 nm or more and 450 nm or less. More preferably, a laser beam having a wavelength of 350 nm or more and 420 nm or less is used. A laser beam having a wavelength of 330 nm or more and 450 nm or less is a laser beam in the ultraviolet to blue wavelength region, and a semiconductor laser beam source can be used as a source of such a laser beam.

[0075] The partial plating method according to the present invention uses a laser beam having a wavelength of 330 nm or more and 450 nm or less, because this can implement hard gold plating to a minute area such as a portion of a contact portion of a connector terminal requiring high wear resistance, for the following reasons described in the text.

[0076] figure 1 The absorption...

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Abstract

Provided are a partial plating method capable of plating a contact portion or the like of a connector terminal with hard gold, a laser plating apparatus capable of partially plating a small area on an object of plating in a highly positional precision, and a plated member. Such a portion of the object (80) made to contact a plating liquid as is to be plated is partially plated by irradiating it with a laser beam having a wavelength of 330 nm and more and 450 nm or less. The laser plating apparatus (10) comprises a plating bath (12), a laser oscillator (14) for irradiating the object (80) with a laser, a transfer device (16) for transferring the object (80), a photoelectric sensor (18) for detecting the position of the positioning hole of the object (80) being transferred, and a galvano-scanner (20) having a galvano-mirror (22) capable of scanning the laser beam, for detecting the position of the positioning hole by the photoelectric sensor (18), to return the scan of the laser beam to a scan starting position. Moreover, the plated member is finely spot-plated by the laser plating apparatus (10).

Description

technical field [0001] The invention relates to a partial electroplating method for selectively electroplating a predetermined area of ​​a member to be electroplated, a laser electroplating device and an electroplating member. More particularly, the present invention relates to a partial plating method suitable for plating minute areas such as contact portions of connector terminals, a laser plating apparatus, and a plating member plated using the laser plating apparatus. Background technique [0002] In a widely used method of partially plating a member to be plated, plating is performed while masking an area of ​​the member to be plated not to be plated with a material such as masking tape, rubber insulator, and polymer resist, and In the above method, electroplating is performed by injecting a plating solution onto an area to be plated while energizing the member to be plated. [0003] However, since the partial plating method using masking requires masking on the member...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/02C23C18/31C25D17/00H01S3/00
Inventor 芳贺孝吉
Owner AUTONETWORKS TECH LTD