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Phenolic epoxy resin system conductive adhesive and preparation thereof

A technology of phenolic epoxy resin and epoxy resin, applied in the direction of online phenolic epoxy resin adhesive, conductive adhesive, etc., can solve the problems of unsatisfactory high temperature resistance and unsatisfactory storage period, and achieve high Practical value, environmental effect and friendly effect

Inactive Publication Date: 2012-05-09
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Chinese patent CN1560169 discloses a weather-resistant epoxy conductive adhesive, but its storage period is not very ideal
Chinese patent CN1939999A discloses a silver powder conductive adhesive, but the high temperature resistance performance is not very ideal

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] The weight percentage of high temperature resistant epoxy conductive adhesive is:

[0025] Novolak epoxy 11.0%

[0026] E-51 7.3%

[0027] CTBN 2.2%

[0028] Active diluent * 4.4%

[0029] LCA-30 1.1%

[0030] Flake silver powder 74%

[0031] * Note: The reactive diluent is 3',4'-epoxycyclohexylmethyl 3,4-epoxycyclohexylcarboxylate.

[0032] Weigh novolac epoxy resin, epoxy resin E-51 and CTBN according to the formula, pre-react at 100°C for 2 hours, then add active diluent, LCA-30 and flake silver powder in sequence according to weight ratio, mix well and evenly, performance data As shown in Table 1 below.

Embodiment 2

[0047] Epoxy Novolac 12.3%

[0048] E-51 8.2%

[0049] CTBN 2.4%

[0050] Active diluent * 4.9%

[0051] LCA-30 1.2%

[0052] Flake silver powder 71%

[0053] *Note: The reactive diluent is 3',4'-epoxycyclohexylmethyl 3,4-epoxycyclohexylcarboxylate.

[0054] Weigh novolac epoxy resin, epoxy resin E-51 and CTBN according to the formula, pre-react at 100°C for 2 hours, then add active diluent, LCA-30 and flake silver powder in sequence by weight, and mix well.

Embodiment 3

[0056] Epoxy Novolac 10.6%

[0057] E-51 7.1%

[0058] CTBN 2.1%

[0059] Active diluent * 4.2%

[0060] LCA-30 1.0%

[0061] Flake silver powder 75%

[0062] * Note: The reactive diluent is 3',4'-epoxycyclohexylmethyl 3,4-epoxycyclohexylcarboxylate.

[0063] Weigh novolac epoxy resin, epoxy resin E-51 and CTBN according to the formula, pre-react at 100°C for 2 hours, then add active diluent, LCA-30 and flake silver powder in sequence by weight, and mix well.

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Abstract

The invention relates to a method for preparing a phenolic epoxy resin system conductive adhesive, which comprises the following steps that: 10.6 to 12.3 percent of phenolic epoxy resin, 7.0 to 8.2 percent of epoxy resin E-51, 2.1 to 2.4 percent of toughener, 4.2 to 4.9 percent of alicyclic epoxy diluent, 1.0 to 1.2 percent of latent curing agent, and 71.0 to 75.0 percent of flake silver powder pre-react at a temperature of 100 DEG C for 2h by weight percentage, then the alicyclic epoxy diluent, the latent curing agent and the flake silver powder are orderly added into the obtained product by weight percentage, and the mixture is fully mixed evenly. The phenolic epoxy resin conductive adhesive resists a high temperature of 180 DEG C, has the tensile shearing strength more than 10MPa and the conductivity reaching a magnitude order of between 10<-3> and 10<-4>ohm.cm, is environment-friendly, and has high practical value to the development of electronic industry.

Description

technical field [0001] The invention belongs to the field of organic conductive adhesives, in particular to a phenolic epoxy resin system conductive adhesive and a preparation method thereof. Background technique [0002] Conductive adhesive, referred to as conductive adhesive, is an adhesive that can effectively bond various materials and has conductive properties. Conductive adhesive can be divided into two categories: structural type and filling type according to its composition. Structural type refers to the polymer material itself as the conductive adhesive matrix itself is an adhesive with conductivity; filled type refers to a conductive material formed by uniformly dispersing conductive particles and additives in the resin. With the development of the electronics industry, the use of conductive adhesives is becoming wider and wider. With the development of high technology, the heat resistance of conductive adhesives is increasingly demanding (long-term heat resistan...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/04C09J9/02
Inventor 虞鑫海孙欢刘万章时佳杨世玉李超宇王宇
Owner DONGHUA UNIV
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