Conduction through a flexible substrate in an article

A technology of flexible substrates and products, applied in medical science, absorbent pads, etc., can solve difficult electrical and mechanical interconnection problems

Inactive Publication Date: 2009-08-12
KIMBERLY-CLARK WORLDWIDE INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, it is difficult to form strong and reliable electrical and mechanical interconnections that are sufficient...

Method used

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  • Conduction through a flexible substrate in an article
  • Conduction through a flexible substrate in an article
  • Conduction through a flexible substrate in an article

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0138] A first copper-based circuit path having a length of about 10 cm, a width of about 10 mm, and a thickness ranging from about 0.1 μm to about 0.4 μm is printed onto one side of the flexible substrate by inkjet printing. The substrate, which functions as the backsheet of the current HUGGIES PULL-UPS STEP 3 training pant, is approximately 0.75 mil (19 μm) thick with a flexibility in the range of approximately 0.0017 to 0.0021 gfcm2 / cm according to the KES Pure Bend test (supra described) measured. A hole measuring approximately 0.1 mm in diameter was formed in the substrate with a pin at the middle of the first circuit path length (approximately 5 cm from each end). The PERMATEX Quick Grid Rear Window Defogger Repair Kit (available from Permatex, Inc., a business with offices in Hartford, Connecticut, U.S.A.) was then applied to the opposite side of the substrate using the PERMATEX Quick Grid Rear Window Defogger Repair Kit. The second circuit path has a length of about 1...

Embodiment 2

[0141] A circuit made according to Example 1 was draped over a standard laboratory flask having a circular upper opening about 70 mm wide and about 200 mm high such that the substrate formed a hemisphere with the holes containing the conductive filler located in the hemisphere bottom and in the center of the flask. The substrate hemispheres were flooded with water and allowed to sit for 10 minutes. Water was then drained from the top of the membrane and the membrane was removed from the flask. The flask below the membrane was found to be completely dry. This example demonstrates that the invention preserves the fluid-tight properties of the substrate.

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Abstract

An article includes a first electrically-conductive circuit-path and a second electrically-conductive circuit-path. A portion of the first circuit-path is positioned proximally adjacent a portion of the second circuit-path at a first predetermined hole location. A first electrically-insulating barrier layer is interposed between the first circuit- path and second circuit-path at the first hole location, and the first circuit-path is conductively connected to the second circuit-path at the first hole location by filling the hole with a conductive filler. The conductive filler is configured such that the first circuit- path is conductively connected to the second circuit-path at the first predetermined hole location to form an interconnecting conductive filler-path between the first circuit-path and the second circuit-path.

Description

Background of the invention [0001] Circuits have been printed or otherwise applied to flexible substrates such as paper, woven fabrics, nonwoven fabrics and polymer films. The circuits incorporate conductive inks, which are applied by conventional ink printing techniques, while various products such as badges, signs and labels incorporate the printed circuits. In particular settings, the printed circuits have been used in hygiene products such as surgical drapes, surgical gowns, garments, personal care absorbent products, and the like. In other arrangements, electrical / electronic circuitry is employed to provide sensors in selected personal care products, such as wetness sensors in disposable baby diapers. [0002] However, conventional ink printed circuit constructions include conductive ink printed on one side of a single layer polymer film or other flexible substrate made of an electrically insulating material. Problems can arise when an ink printed circuit on one side of...

Claims

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Application Information

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IPC IPC(8): A61F13/42
CPCA61F13/42A61F2013/8479A61F13/53A61F13/49
Inventor D·D·蒂皮T·M·埃尔斯三世
Owner KIMBERLY-CLARK WORLDWIDE INC
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