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An induction wafer baking system

A baking and pancake technology, applied in the field of automatic pancake baking equipment, can solve maintenance and safety issues, achieve the effects of preventing wear or disconnection, low cost, and avoiding maintenance and production accidents

Inactive Publication Date: 2009-08-19
NESTEC SA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This leads to maintenance and safety issues due to the large amount of dust and grease particles generated in the pancake baking environment

Method used

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  • An induction wafer baking system
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  • An induction wafer baking system

Examples

Experimental program
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Embodiment Construction

[0036] The invention relates to an automatic pancake baking plant 1 for baking pancakes from liquid or pasty dough.

[0037] The apparatus comprises a plurality of baking molds 2, each baking mold has a pair of upper baking plates 3 and lower baking plates 4 all made of cast iron, the outer surfaces of the baking plates (i.e. not contacting the pancake batter during cooking) contact surfaces) are covered with insulating material such as Glastherm 68, an asbestos-free, powder-free hardboard enclosed and sealed within an outer steel shell.

[0038] figure 1 with 2 A baking mold 2 according to the invention is shown. The upper baking plate 3 of the baking mold 2 is fixed on the equipment frame, while the lower baking plate 4 is movable relative to the upper baking plate 3 . In order to realize the movement of the lower baking plate 4 relative to the upper baking plate 3, a image 3 with 4 The moving device shown in , so that the baking mold 2 can be moved from the closed con...

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PUM

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Abstract

The present invention relates to an automatic wafer baking apparatus (1) for baking wafers from a liquid or pasty dough, said apparatus (1) comprising at least two baking moulds (2), each having one pair of top (3) and lower (4) baking plates, said apparatus (1) further comprising moving means (5, 6, 7) for moving at least one plate relative to the other so that each baking mould (2) can move from a closed configuration to an open configuration, heating means for heating the plates (3, 4) to a predetermined baking temperature, means for injecting a predetermined quantity of dough between the baking plates (3, 4) of each mould (2), and means (12, 13) for removing a baked wafer from a baking mould (2), characterized in that each baking mould (2) is stationary in the apparatus (1) and is independent from the other(s).

Description

technical field [0001] The invention relates to an apparatus for the automatic baking of crepes on an industrial scale, preferably using induction heating. Background technique [0002] Crepe production is widely used in the confectionary industry and is becoming more popular as consumers seek lighter weight but still appealing confectionary products. Therefore, it is hoped that the types of pancakes will further increase. [0003] Pancake is a baked product made from pancake batter (milk egg batter, batter) (ie pancake dough), and has the characteristics of crisp, crisp and brittle. The crepes are thin, with an overall thickness typically between <1 and 4mm and typical product densities in the range of 0.1 to 0.3g / cm 3 . The surface is precisely shaped to follow the surface shape of the plates on both sides of the pancake when it is baked. Crepes are usually patterned on one or both sides. [0004] In "Encyclopaedia of Food Science, Food Technology and Nutrition p41...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A21B5/02
CPCA21B5/02
Inventor N·T·帕森斯
Owner NESTEC SA
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