Reflux brazier soldering flux collection device and using method thereof

A reflow oven and collection device technology, applied in auxiliary devices, cleaning heat transfer devices, welding equipment, etc., can solve the problems of increasing maintenance time and work difficulty, affecting the production efficiency and output of customers, and achieving a good collection effect Effect

Active Publication Date: 2009-08-26
上海朗仕电子设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

But this increases the maintenance time and work difficulty, which indirectly affects the production efficiency and output of customers.

Method used

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  • Reflux brazier soldering flux collection device and using method thereof
  • Reflux brazier soldering flux collection device and using method thereof

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Embodiment Construction

[0021] The present invention will be further described below in conjunction with accompanying drawing.

[0022] see figure 1 , figure 2 , the reflow soldering furnace flux collection device of the present invention includes at least two collection units with the same structure (5 collection units shown in this embodiment), a three-way air intake pipeline (not shown) and an exhaust pipe road (not shown). The collection units are connected in series, each collection unit includes a heat exchange column 1 and a collection bottle 2, the collection bottle 2 is arranged below the heat exchange column and connected to the heat exchange column 1 through a connecting pipeline with a ball valve 3 connected. The heat exchange column 1 includes a column body 11 and a cooling water pipeline 12 installed in the column body, and a gas inlet 111 and an outlet 112 are provided on the column body 11 . The gas inlet of the first heat exchange column is connected to the three-way inlet pipel...

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Abstract

The invention provides a reflux brazier soldering flux collection device and a using method thereof. The collecting device comprises at least two collecting units with a same structure, a tee inlet pipeline and a ventilation pipeline, wherein the collecting units are connected in series sequentially, every collecting unit comprises a heat exchange post and a collecting bottle, and each collecting bottle is arranged below the heat exchange post and is communicated with the heat exchange post; the heat exchange posts comprise post bodies and cooling water pipelines arranged in the post bodies; air inlets and air outlets are arranged on the post bodies, the air inlet of the first heat exchange post is connected with the tee inlet pipe, the air outlet of the previous heat exchange post is connected with the air inlet of the latter heat exchange post, and the air outlet of the last heat exchange post is connected with the ventilation pipeline. The using method comprises the steps of recovering soldering flux and cleaning the heat exchange posts. The reflux brazier soldering flux collection device has the advantage of good collection effect and the function of automatic cleaning, and the service life of the reflux brazier soldering flux collection device is more than five times of that of the traditional collection device.

Description

technical field [0001] The invention relates to an auxiliary equipment for producing electronic components, in particular to a flux collecting device for a reflow soldering furnace and a using method thereof. Background technique [0002] Reflow Oven (Reflow Oven) is a device used to solder circuit boards carrying electronic components. It provides a heating environment to heat and melt the solder paste so that surface mount components and circuit boards are reliably bonded together through the solder paste alloy. The solder paste used for brazing is made of fat-like flux and powder solder into a paste, which is applied to the soldering parts of the components of the circuit board by printing, and the electronic components are precisely mounted on it, and the reflow oven is used to Heat and melt to achieve reliable brazing of components. [0003] The flux in solder paste is usually a mixture of rosin as the main component, which is an auxiliary material to ensure the smoot...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K3/08B23K1/008F28D7/10F28G13/00
Inventor 倪党生卢明
Owner 上海朗仕电子设备有限公司
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