Resistance metallic plate low-resistance value sheet shape resistor and manufacturing method thereof

Abstract

The invention relates to a resistance metallic plate low-resistance value sheet shape resistor and the manufacturing method thereof, provides a method for manufacturing high reliable low-resistance value sheet shape resistor with resistance value below 1momega without complex processes, which is characterized in that: welding a copper sheet (13) to one or two surfaces of a resistance metallic plate (11) by scolder (12); removing oxide-film from the surface; forming tinning film (14) on the whole surface of the copper sheet; forming a combined multi-sheet body (20); cutting the combined multi-sheet body into a rectangle with a desired width to form a rectangle multi-sheet body (22); cutting from the basic center of the opposite short sides on the one ore two surface with tinning film of the rectangle multi-sheet body along the long sides according to a defined width; removing the tinning film, copper sheet, scolder and at least the scolder diffusion layer of the resistance metallic plate; forming concave sections (15) on one or two surfaces, forming a protective film (16) on the bottom of the concave sections; cutting off the rectangle multi-sheet body in the desired width; and manufacturing sheet shape resistor (10).

Description

technical field [0001] The invention relates to a low-resistance chip resistor of a resistance metal plate and a manufacturing method thereof. Background technique [0002] Electronic components such as shunt resistors that detect current when the control circuit of an engine or a switching regulator is energized have conventionally used metal plate chip resistors in which electrode layers are formed on both ends of a plate-shaped metal resistor containing an alloy. device, its resistance value is relatively low, set to about a few mΩ to 1Ω. For such metal plate chip resistors, it is desired that the temperature coefficient of resistance and current characteristics be stable, the inductance value be suppressed to a low level, and the current be detected with high precision. -A) describes the manufacturing method of the chip resistor corresponding to the above-mentioned requirements. [0003] That is, in JP-2003-115401-A, a method of manufacturing a low-resistance resistor ...

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Problems solved by technology

[0004] The manufacturing method of the above-mentioned low-resistance resistor has the following problems: the process of cutting the side surface or upper and lower surfaces of the metal resistor to adjust the resistance value is too time-consuming, and the productivity is reduced. In addition, high-conductivity materials such as copper The specific method of crimping or welding the sheet on the metal resistor is not recorded, and it is difficult to introduce the method of JP-2003-115401-A into the actual production site

[0006] However, when the ceramic substrate and the thin-plate resistor (resistor metal plate) are joined by solder containing an active metal, there is a problem that the solder is expensive, the joining takes too much time, and the productivity decreases.

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