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Projection PCB circuit board and manufacturing method thereof

A technology of PCB circuit board and manufacturing method, which is applied in the direction of printed circuit manufacturing, printed circuit, printed circuit parts, etc., can solve the problems of cumbersome, complex PCB circuit board manufacturing method and manufacturing process, unfavorable mass production, etc., to achieve The effect of reducing production costs

Inactive Publication Date: 2009-08-26
SHENZHEN TONGFAXIN CIRCUIT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, the manufacturing method and manufacturing process of the boss PCB circuit board are very complicated and cumbersome, which is not conducive to mass production. Therefore, there are defects in the prior art and methods, and need to be improved.

Method used

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  • Projection PCB circuit board and manufacturing method thereof
  • Projection PCB circuit board and manufacturing method thereof
  • Projection PCB circuit board and manufacturing method thereof

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Embodiment Construction

[0026] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0027] Such as figure 1 , figure 2 , image 3 and Figure 4 As shown, a boss PCB circuit board includes a PCB substrate 106, and the PCB substrate 106 includes a convex surface 112 and a front surface 116, and a first electrode 103 and a second electrode 104 are arranged on the convex surface 112, wherein , the first electrode 103 is a central electrode located at the center of the PCB substrate 106, and the second electrode 104 is a ring-shaped electrode arranged around the central electrode and concentric with the central electrode; for example, the first electrode 103 Look at the center of the circle, the second electrode 104 is a ring made of the center of the circle; or the second electrode 104 is set to a square frame shape, and the ring electrode has a conductive ring 105 extending to the edge of the PCB substrate 106 insulating la...

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Abstract

The present invention discloses a projection PCB circuit board and a manufacturing method thereof, wherein the projection PCB circuit board comprises a PCB substrate which comprises a convex surface and a front surface. The convex surface is installed with a first electrode and a second electrode, wherein the first electrode is a central electrode which is positioned at the circle center position of PCB substrate. The second electrode is an annular electrode which is installed around the central electrode and is concentric with the central electrode. The annular electrode is provided with a conductive ring which extends to the edge of insulating layer of PCB substrate. The first electrode is a projection electrode and is higher than the second electrode which is higher than the conductive ring. The electrodes at two surfaces of insulating layer of PCB substrate are electrically connected through the plated-through hole installed on the PCB substrate. When the PCB substrate manufacturing method is adopted, the PCB substrate can realize the large-scale and industrial application of microphone, reduces the manufacturing cost and guarantees the using of low-cost electronic product for public.

Description

technical field [0001] The present invention relates to a boss PCB circuit board, and also relates to a method for manufacturing the boss PCB circuit board. Background technique [0002] Microphones are widely used in modern life, but due to technical limitations, they cannot be soldered to the host printed circuit board (PCB) through reflow soldering process like other components, but can only be used as a separate device for manual Single-piece welding, labor productivity is extremely low, and the reliability of electronic products after welding cannot be guaranteed. Among them, designing a printed circuit board suitable for SMT has become a technical problem. In addition, the manufacturing method and manufacturing process of the boss PCB circuit board are very complicated and cumbersome, which is not conducive to mass production. Therefore, the prior art and method have defects and need to be improved. Contents of the invention [0003] The technical problem to be sol...

Claims

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Application Information

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IPC IPC(8): H05K1/11H05K3/34H05K3/00
Inventor 刘国升
Owner SHENZHEN TONGFAXIN CIRCUIT TECH