Process for producing composite prepreg base, layered base, and fiber-reinforced plastic
A technology of prepreg and manufacturing method, applied in the field of fiber reinforced plastics, can solve problems such as poor fiber fluidity, and achieve the effects of good fluidity, excellent mechanical properties, and a wide selection range
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Embodiment 1
[0220]Heat and knead epoxy resin with a kneader ("Epikote (registered trademark)" 828: 30 parts by weight, "Epikote (registered trademark)" 1001: 35 parts by weight, "Epikote (registered trademark)" manufactured by Japan Epoxy Resin Co., Ltd., "Epikote (registered trademark)" )” 154: 35 parts by weight), 5 parts by weight of thermoplastic resin polyvinyl formal (CHISSO (Co., Ltd.) “Vinylec (registered trademark)” K), 3.5 parts by weight of curing agent dicyandiamide (Japan Epoxy Resin Co., Ltd. ) DICY7), and 4 parts by weight of curing accelerator 3-(3,4-dichlorophenyl)-1,1-dimethylurea (DCMU99 manufactured by Hodogaya Chemical Industry Co., Ltd.), to prepare polyvinyl alcohol Uncured epoxy resin composition 1 in which formaldehyde is homogeneously dissolved. This epoxy resin composition 1 was coated on release paper using a reverse roll coater (reverse roll coater) to make 19g / m 2 The resin film 1.
[0221] Next, a resin film 1 is laminated on both sides of unidirectionally...
Embodiment 2
[0230] Heating and kneading epoxy resin with a kneader ("Epikote (registered trademark)" 828: 9 parts by weight, "Epikote (registered trademark)" 1001: 35 parts by weight, "Epikote (registered trademark)" manufactured by Japan Epoxy Resin Co., Ltd. )" 1004: 20 parts by weight, "Epikote (registered trademark)" 807: 36 parts by weight), 5 parts by weight thermoplastic resin polyvinyl formal (CHISSO Co., Ltd. "Vinylec (registered trademark)" K), 4.5 parts by weight Parts of curing agent dicyandiamide (Japan Epoxy Resin Co., Ltd. DICY7), and 3 parts by weight of curing accelerator 3-(3,4-dichlorophenyl)-1,1-dimethylurea (Hodogaya Chemical DCMU99 manufactured by Kogyo Co., Ltd., uncured epoxy resin composition 2 (resin minimum viscosity 3.4 Pa·s) in which polyvinyl formal was uniformly dissolved was prepared.
[0231] Using this epoxy resin composition 2, a prepreg base material 2 (tensile strength of carbon fiber 4,900MPa, tensile modulus of elasticity 235GPa, weight per unit area...
Embodiment 3
[0237] Epoxy resin (ELM434 manufactured by Sumitomo Chemical Co., Ltd.: 90 parts by weight, Epicron 830 manufactured by Dainippon Ink Chemical Industry Co., Ltd.: 10 parts by weight) and 15 parts by weight of thermoplastic resin polyethersulfone (Sumitomo Chemical Co., Ltd. Industrial Co., Ltd. SUMIKAEXCELPES5003P) and 35 parts by weight of curing agent 4,4' diaminodiphenyl sulfone (Sumicure S manufactured by Sumitomo Chemical Industry Co., Ltd.) to prepare an uncured epoxy resin composition in which polyethersulfone is uniformly dissolved 4 (minimum viscosity of resin 0.4Pa·s).
[0238] Using this epoxy resin composition 4, a prepreg base material 3 (tensile strength of carbon fiber 5,400MPa, tensile modulus of elasticity 294GPa, weight per unit area of carbon fiber 150g / m 2 , matrix resin content 25wt%, prepreg substrate thickness 0.14mm).
[0239] Incisions were introduced into this prepreg base material, and a resin film (resin weight per unit area: 40 g / m 2 , film thi...
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Abstract
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Claims
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