Wire bonding method in chip package process
A chip packaging and chip technology, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of open/short circuit test waste, reduce packaging efficiency, and the wiring area is too small, so as to facilitate normal welding and reduce open/short circuit Test the occurrence rate of waste products and wrong welding waste products, and the effect of increasing the bonding area
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Embodiment 1
[0030] Please refer to figure 2 , which is a schematic diagram of a carrying unit carrying a chip obtained by adopting a conventional die-bonding mode in a chip design mode. The carrying unit 10 is a part of a carrier for carrying chips in a chip package, and usually the carrier has a plurality of such carrying units arranged in a matrix or in a single row. As shown in the figure, each carrying unit 10 is used to carry a chip 30 . A pin 20 is provided corresponding to each carrying unit 10 . The chip 30 has wire bonding pads 32 , and bonding wires 40 are connected between the wire bonding pads 32 of the chip 10 and the pins 20 of the carrier carrying the chip. Since the wire bonding pad 32 is small and designed in a horizontal rectangle, for example, in a TO-220 chip, its size is 0.36×0.46mm, which cannot meet the size of the wire bonding pad for the UAB-320 automatic ultrasonic thick aluminum wire pressure welding machine Requirements (at least 0.52×0.45mm). For this, us...
Embodiment 2
[0032] Please refer to Figure 4 , which is a schematic diagram of a carrying unit carrying a chip obtained by adopting a conventional die-bonding mode in another chip design mode. As shown in the figure, the carrying unit 100 is used to carry a chip 300 , and pins 200 are provided corresponding to the carrying unit 100 . The chip 300 has a plurality of wire bonding pads 320 and 340 , wherein the wire bonding pad 320 in the upper right corner is closer to the pin 200 and is prone to collision during wire bonding. For example, in the TO-220 chip, the distance between the bonding pad 320 and the pin 200 is required to be at least 2.3mm, and due to the special design of the chip 300, the distance between the bonding pad 320 and the pin 200 is relatively close, which can usually be 1.9 mm. mm. For this, use figure 1 In the shown method, first spot solder 500 is placed on the carrying unit 100, and then the chip 300 is placed thereon; the chip 300 is rotated and pressed, so that...
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