Heat radiation die set and radiation system applying phase change metal thermal interface material

A heat dissipation module and heat dissipation system technology, applied in the direction of cooling/ventilation/heating transformation, electrical components, electric solid devices, etc., can solve the problem of affecting the service life and reliability of electronic components, damaging microelectronic components, and deteriorating the performance of microelectronic components and other problems, to achieve the effects of low cost, avoiding liquid phase leakage, and simple process

Inactive Publication Date: 2009-10-14
萧复元
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Problems solved by technology

Once the junction temperature of microelectronic components exceeds the safe operating temperature, the performance of microelectronic components will be deteriorated, or the microelectronic components will be damaged, seriously affecting the service life and reliability of electronic components

Method used

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  • Heat radiation die set and radiation system applying phase change metal thermal interface material
  • Heat radiation die set and radiation system applying phase change metal thermal interface material
  • Heat radiation die set and radiation system applying phase change metal thermal interface material

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Embodiment Construction

[0046] Please also refer to Figure 3Aand Figure 3B , which are respectively a schematic diagram of the heat dissipation module and a schematic diagram of the bottom surface of the radiator of the present invention. The heat dissipation module 30 of the present invention can quickly transfer the heat generated by an electronic component 32 to the external environment. The heat dissipation module 30 includes a heat sink 31 and a phase-change metal thermal interface material (TIM) 34 .

[0047] The heat sink 31 is disposed above the electronic component 32 , and the bottom surface 311 of the heat sink 31 has at least one groove 312 . The phase change metal thermal interface foil 34 is disposed between the electronic component 32 and the bottom surface 311 of the heat sink 31 as a thermal interface material between the electronic component 32 and the heat sink 31 . Two sides of the phase-change metal thermal interface foil 34 are respectively in contact with the bottom surfac...

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Abstract

The invention relates to a heat radiation die set and a radiation system applying a phase change metal thermal interface material. The heat radiation die set and the heat radiation system can ensure that heat generated by the operation of an electronic element can be rapidly transmitted to outside environments. The heat radiation die set comprises a radiator and a phase change metal thermal interface material (TIM), wherein the radiator is arranged above the electronic element, and the bottom surface of the radiator is at least provided with a slot. The phase change metal thermal interface material is arranged between the electronic element and the bottom surface of the radiator, and is used as a thermal interface material between the electronic element and the radiator. When the phase change metal thermal interface material is melted by heating, part of hot melting liquid can flow into the slot so as to prevent the superfluous hot melting liquid from leaking out of a thermal interface.

Description

technical field [0001] The invention relates to a heat dissipation module and a heat dissipation system, in particular to a heat dissipation module and a heat dissipation system using a phase change metal thermal interface foil as a thermal interface material. Background technique [0002] Constructing microelectronic components, such as high-brightness light-emitting diodes and central processing units, etc., due to the development trend towards high power, high speed, and / or miniaturization, the high heat flux generated by microelectronic components must be removed to reduce the junction temperature Maintain below its safe operating temperature. Once the junction temperature of the microelectronic element exceeds the safe operating temperature, the performance of the microelectronic element will be degraded, or the microelectronic element will be damaged, seriously affecting the service life and reliability of the electronic element. [0003] Along with the heat dissipati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/34H01L23/427H01L23/367
Inventor 萧复元林成全庄天赐
Owner 萧复元
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