Electronic, in particular microelectronic, functional group and method for its production

Abstract

The invention relates to an electronic, in particular microelectronic, functional group and to a method for its production. The method according to the invention includes the following steps: a) coating of a mount (5a) with a non-conductive adhesive (4a); b) application of a conductor structure (3) to a subarea of the adhesive layer (4a); c) arrangement of an electronic component (1) with at leastone external electrical connecting contact (2) on the adhesive layer (4a) and on the conductor structure (3), with the at least one connecting contact (2) of the electronic component (1) being brought directly into contact with the conductor structure (3), and with a part of the outer casing of the component (1) being brought directly into contact with the adhesive layer (4a). The method according to the invention allows electronic, in particular microelectronic, functional groups to be produced with care, quickly and in particular at low cost.

Description

Technical field [0001] The present invention relates to an electronic, especially microelectronic functional group and a method of producing such a functional group. Background technique [0002] An electronic functional group usually includes at least one or more electronic components, a conductive structure contacting the electronic components, and a carrier coated with the electronic components and the conductive structure. [0003] In order to electrically connect an electronic component, especially a microelectronic component, such as a chip, to the conductor structure and install it on a carrier, various methods are known: [0004] On the one hand, it is known to process the chip using electrical connection contacts located on a conductor structure coated on a carrier, and by inputting energy, such as heat, ultrasound or voltage, to contact the metal contacts of the chip. Create an integral joint with the designated contact of the conductor structure. [0005] Another possi...

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Problems solved by technology

[0008] A disadvantage of the above-mentioned methods is that these methods either greatly aggravate the thermal and / or mechanical energy of the electronic component, or result in insufficient mechanical connection between the component and the carrier

In the latter case, more measures are required to ensure the mechanical mounting of the components, which however leads to a more complex method

Another disadvantage of the above methods is that these methods require partially conductive adhesives, however this type of adhesive is relatively expensive and not suitable for many applications due to its insulating properties

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