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Alignment mark, alignment system and alignment method for photomask processor

A technology for aligning marks and aligning systems, which is applied in photolithography exposure devices, microlithography exposure equipment, optics, etc., can solve the problem of wasting mask resources, not considering the influence of optical interference and diffraction, and the difficulty of marking size. To meet the requirements of lithography machines and other issues, to achieve the effect of improving contrast and alignment accuracy

Active Publication Date: 2014-05-21
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Although the above-mentioned encoding method can be applied to the transmission type one-dimensional and two-dimensional zero grating, since the lithography machine requires that the size of the alignment mark should not be too large, otherwise the precious mask resources will be wasted, and the above-mentioned transmission coding zero grating The grating alignment mark, its mark size is often difficult to meet the requirements of the lithography machine; moreover, because the above method uses a random encoding method, it does not take into account the actual possible optical interference and diffraction effects, which will greatly Therefore, how to improve the alignment accuracy of the lithography machine under the premise of improving the contrast of the alignment signal has become an urgent solution for those skilled in the art. topic

Method used

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  • Alignment mark, alignment system and alignment method for photomask processor
  • Alignment mark, alignment system and alignment method for photomask processor
  • Alignment mark, alignment system and alignment method for photomask processor

Examples

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no. 1 example

[0039] see figure 2 , which is a schematic diagram of the reference mark, which includes a two-dimensional reference mark grating and multiple reference mark grating structures. The two-dimensional grating is composed of a black light-transmitting square and a white opaque square, which is in the center, has a two-dimensional structure, is a normalized mark, and can be a periodic or aperiodic grating. see you again image 3 , is a schematic diagram of the structure of a two-dimensional grating. In this embodiment, the two-dimensional grating is rectangular, and the small black light-transmitting blocks are distributed symmetrically around the center, which is a square with a side length of DL 0 , the side length of each white opaque square is DL 1 . The multiple grating structures include four grating structures (namely, grating 1, grating 2, grating 3 and grating 4), and the four grating structures are arranged around the two-dimensional grating in a "cross" shape. Amon...

no. 2 example

[0050] The main difference between this embodiment and the first embodiment is that the grating structures of the second partial structure of the reference mark are independent of each other, that is, each has a different encoding matrix. For details, please refer to Image 6 , the reference mark includes a reference mark two-dimensional grating and a plurality of reference mark grating structures (four in this embodiment), the structure of the two-dimensional grating can be found in image 3 , and the four grating structures (grating 1 to grating 4) are arranged around the two-dimensional grating in a "ten" shape, wherein grating 3 and grating 4 are used for alignment in the horizontal direction (X direction), and grating 1 and grating 2 for alignment in the vertical direction (Y direction). The grating 1, the grating 2, the grating 3 and the grating 4 use different encoding matrices, and they are respectively composed of three groups of aperiodic one-dimensional grating mar...

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Abstract

The invention provides an alignment system used for a photomask processor, comprising a mask or a stencil stage on which a transmission-type mask target is carved, an optical intensity detector which is provided with a reference mark, and the like, wherein, the reference mark comprises a reference mark two-dimensional grating which is positioned in the center and is provided with a two-dimensionalstructure, and a plurality of reference mark grating structures which are arranged around the reference mark two-dimensional grating and can be used for bidirectional alignment; the transmission-type mask target comprises an alignment mark two-dimensional grating which is used for the coarse alignment with the reference mark two-dimensional grating and is provided with the two-dimensional structu re, and a plurality of alignment mark grating structures which are arranged around the alignment mark two-dimensional grating and are used for the perfect alignment with the reference mark grating structures, and therefore the alignment accuracy can be effectively improved by the coarse alignment and the perfect alignment; and as the grating comprises a light transmission part and a light-tight part, the contrast grade of an alignment signal can be increased.

Description

technical field [0001] The present invention relates to an alignment technology of a lithography apparatus, and in particular, to an alignment mark, an alignment system and an alignment method for the lithography apparatus. Background technique [0002] Existing lithography equipment often uses two alignment schemes, one is the TTL alignment technology through the lens, and the other is the OA off-axis alignment technology. In the TTL alignment technology, the alignment mark on the mask is first illuminated by the laser to make an image on the plane of the silicon wafer, and then the workpiece table is moved, so that the reference mark on the workpiece table scans the image formed by the alignment mark, and The imaged light intensity is sampled by the light intensity detector. When the maximum light intensity is output, it indicates that the reference mark on the workpiece table coincides with the alignment mark on the mask, which is the correct alignment position, which is ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F9/00G03F7/20
Inventor 胡明辉宋海军王海江
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD