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Cutting device

A technology of cutting device and cutting fluid, which is applied in metal processing and other fields, and can solve problems such as rising costs

Active Publication Date: 2009-12-02
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in the countermeasure of Patent Document 1, a high-pressure pump is required in addition to the cutting device, and in addition to this, the piping in the cutting device needs to be made of a high-pressure specification, and there is a problem that the cost increases.

Method used

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Examples

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Embodiment Construction

[0020] Next, a cutting device which is the best mode for carrying out the present invention will be described with reference to the drawings.

[0021] figure 1 It is an external perspective view showing an example of the cutting device according to the embodiment of the present invention. The cutting device 10 of the present embodiment is a device for cutting a workpiece 11 such as a CSP substrate to be cut along a planned dividing line, and its schematic configuration is as follows: figure 1 As shown, it includes a chuck table 12 , an imaging component 13 and a cutting component 20 .

[0022] The cutting member 20 includes: a disc-shaped cutting blade 21 ; an unillustrated spindle unit including a drive source that rotatably supports the cutting blade 21 and drives the cutting blade 21 to rotate; and a blade cover 22 , which is arranged on a part of the front end side of the spindle unit, and surrounds the cutting tool 21 . As a result, the cutting tool 21 is rotatably sup...

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PUM

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Abstract

The present invention provides a cutting device which can reliably remove the chip generated in cutting without a high-pressure pump or a high-pressure standard pipe, etc. A front nozzle opening (24a) of a chip removing nozzle (24) is formed to flat and furthermore the cross section of the front nozzle opening is provided with a long axis which is approximately parallel with the holding surface (12a) of a chuck operating platform (12), and the liquid is sprayed from the chip removing nozzle (24) to two sides next to a processing point (P), therefore, the liquid with increased flowing speed can be sprayed planarly without the high-pressure pump or the high-pressure standard pipe, etc. thereby reliably removing the chip generated in cutting. Hereon, the unfavorable condition that the chip which should be removed and sprays along with the liquid sprayed from the chip removing nozzle (24) collides with a cutting liquid nozzle (23) through equipping the cutting liquid nozzle (23) and the chip removing nozzle (24) to the opposite side of the side with sprayed cutting liquid by the rotation of a cutter (21).

Description

technical field [0001] The present invention relates to a cutting device capable of reliably removing chips generated when, for example, a CSP substrate is cut using a cutting tool. Background technique [0002] With the increase in density and miniaturization of electronic equipment, semiconductor devices such as IC (integrated circuit: integrated circuit) and LSI (large-scale integration: large-scale integration) used in the electronic equipment are required to be further miniaturized . In order to meet this demand, the semiconductor device adopts a method of not only reducing the size of the internal circuit, but also greatly changing the packaging method to reduce the outer shape. As part of such a process, a packaging method called CSP (ChipSize Package: Chip Size Package) has begun to be used, which makes the external size of the finished product almost the same as the size of the bare chip (BareChip). In this method, first, a plurality of bare chips of semiconductor...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B26D1/143
Inventor 安田祐树田中万平楠欣浩石山慎一植山博光
Owner DISCO CORP