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Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method

A substrate processing device and substrate technology are applied to the substrate processing device and the substrate processing, each unit, the substrate holding mechanism, various components or devices, the substrate holding mechanism and the substrate holding field, which can solve the problem of unstable flow of pure water, etc. Achieving the effect of reliable control, improved processing efficiency, and improved responsiveness delay

Active Publication Date: 2009-12-09
EBARA CORP
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Problems solved by technology

In the conventional structure, since one head (header) supplies pure water to each grinding unit through a plurality of pipes, the flow rate of pure water in a certain grinding unit may sometimes be affected by the use of pure water in other grinding units. unstable situation

Method used

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  • Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method
  • Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method
  • Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method

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Embodiment Construction

[0121] Hereinafter, embodiments of the substrate processing apparatus of the present invention will be described in detail with reference to the drawings. The same reference numerals are assigned to the same or corresponding constituent elements, and duplicate descriptions thereof will be omitted.

[0122] figure 1 It is a plan view showing the overall structure of a substrate processing apparatus according to an embodiment of the present invention. Such as figure 1 As shown, the substrate processing apparatus has a substantially rectangular housing 1, and the inside of the housing 1 is divided into a loading / unloading unit 2, a polishing unit 3, and a cleaning unit 4 by partition walls 1a, 1b. The loading / unloading unit 2, the grinding unit 3, and the cleaning unit 4 described above are combined independently and exhausted independently. In addition, the substrate processing apparatus has a control unit 5 that controls substrate processing operations. The loading / unloadin...

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Abstract

A substrate processing apparatus, a substrate processing method, a substrate holding mechanism, and a substrate holding method are disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

Description

technical field [0001] The present invention relates to a substrate processing apparatus and a substrate processing method, and more particularly to a substrate processing apparatus and a substrate processing method used when polishing a substrate such as a semiconductor wafer to be flat. [0002] In addition, the present invention also relates to a substrate holding mechanism and a substrate holding method, and particularly relates to a substrate holding mechanism suitable for being incorporated in a cleaning device or a drying device for substrates such as semiconductor wafers. [0003] In addition, the present invention relates to each unit, various components, or devices used in the substrate processing apparatus. Background technique [0004] In recent years, with the advancement of high integration of semiconductor devices, the wiring of circuits has gradually become finer, and the distance between wirings has gradually become smaller. In the manufacture of semiconduc...

Claims

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Application Information

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IPC IPC(8): H01L21/00H01L21/02B24B29/02B08B3/02B05B3/12H01L21/677H01L21/683H01L21/687H01L21/66
Inventor 宫崎充胜冈诚司松田尚起国泽淳次小林贤一外崎宏筱崎弘行锅谷治森泽伸哉小川贵弘牧野夏木
Owner EBARA CORP
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