Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method

A substrate processing device and substrate technology are applied to the substrate processing device and the substrate processing, each unit, the substrate holding mechanism, various components or devices, the substrate holding mechanism and the substrate holding field, which can solve the problem of unstable flow of pure water, etc. Achieving the effect of reliable control, improved processing efficiency, and improved responsiveness delay

Active Publication Date: 2009-12-09
EBARA CORP
View PDF1 Cites 69 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the conventional structure, since one head (header) supplies pure water to each grinding unit through a plurality of pipes, the flow ra

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method
  • Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method
  • Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0121] Hereinafter, embodiments of the substrate processing apparatus of the present invention will be described in detail with reference to the drawings. The same reference numerals are assigned to the same or corresponding constituent elements, and duplicate descriptions thereof will be omitted.

[0122] figure 1 It is a plan view showing the overall structure of a substrate processing apparatus according to an embodiment of the present invention. Such as figure 1 As shown, the substrate processing apparatus has a substantially rectangular housing 1, and the inside of the housing 1 is divided into a loading / unloading unit 2, a polishing unit 3, and a cleaning unit 4 by partition walls 1a, 1b. The loading / unloading unit 2, the grinding unit 3, and the cleaning unit 4 described above are combined independently and exhausted independently. In addition, the substrate processing apparatus has a control unit 5 that controls substrate processing operations. The loading / unloadin...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

A substrate processing apparatus, a substrate processing method, a substrate holding mechanism, and a substrate holding method are disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

Description

technical field [0001] The present invention relates to a substrate processing apparatus and a substrate processing method, and more particularly to a substrate processing apparatus and a substrate processing method used when polishing a substrate such as a semiconductor wafer to be flat. [0002] In addition, the present invention also relates to a substrate holding mechanism and a substrate holding method, and particularly relates to a substrate holding mechanism suitable for being incorporated in a cleaning device or a drying device for substrates such as semiconductor wafers. [0003] In addition, the present invention relates to each unit, various components, or devices used in the substrate processing apparatus. Background technique [0004] In recent years, with the advancement of high integration of semiconductor devices, the wiring of circuits has gradually become finer, and the distance between wirings has gradually become smaller. In the manufacture of semiconduc...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L21/00H01L21/02B24B29/02B08B3/02B05B3/12H01L21/677H01L21/683H01L21/687H01L21/66
Inventor 宫崎充胜冈诚司松田尚起国泽淳次小林贤一外崎宏筱崎弘行锅谷治森泽伸哉小川贵弘牧野夏木
Owner EBARA CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap