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Method for corroding GPP chips with precedence order method

An optimal sequence method and chip technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problem of long-term reliability of inconsistent terminal power devices, improve groove shape, improve product qualification rate, and uniform groove width. and depth effects

Active Publication Date: 2009-12-16
安徽钜芯半导体科技有限公司
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a method for corroding GPP chips with an optimal sequence method to solve the problem of long-term reliability of terminal power devices caused by inconsistencies in products during the GPP trenching corrosion process

Method used

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  • Method for corroding GPP chips with precedence order method
  • Method for corroding GPP chips with precedence order method
  • Method for corroding GPP chips with precedence order method

Examples

Experimental program
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Embodiment 1

[0016] Example 1 (acid solution used, time)

[0017] First, pre-process the chip: in an oven, heat up to 130°C, control the temperature at 125°C-135°C, and pre-bake the chip for 15 minutes, as long as there is no moisture on the surface of the chip, and then naturally cool to At room temperature, the role of pre-treatment is to make the properties of the chip consistent when it enters the acid tank.

[0018] The number of chips in each batch is 500 pieces. Teflon baskets of 25 pieces are used for trenching. Two baskets (50 pieces) can be trenched at the same time in the acid tank. Therefore, each batch of chips is divided into 10 chips, and the first to the tenth chips are marked in order. Frame, and mark the direction at the same time. The acid solution in the acid tank can be a conventional ditching acid solution, such as: 5525 (that is, a mixed acid of 5 parts hydrofluoric acid, 5 parts nitric acid, 2 parts glacial acetic acid, and 5 parts sulfuric acid, the above are parts by ...

Embodiment 2

[0030] First, the chip is pre-processed, and the method is the same as that in Example 1.

[0031] The number of chips in each batch is 500 chips, and 25 Teflon baskets are used for trenching. Two baskets (50 chips) can be trenched at the same time in the acid tank. Therefore, each batch of chips is divided into 10 racks.

[0032] In this embodiment, first ditch the chip of the first rack. First, ditch the chip with the direction mark upward for 8 minutes. Then, turn the chip 90 degrees and ditch the chip with the direction mark toward the left for 10 minutes; wait for the first rack to open the groove. After the ditching is completed, the above-mentioned method is used to ditch the second chip, and so on.

[0033] After the above-mentioned trenching is completed, measure the trench depth of all the chips, divide all the chips according to the trench depth, the trench depth difference is 5um as a level, and then divide them into 10 racks, put them into the acid tank and trench the...

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Abstract

The invention provides a method for corroding GPP chips with a precedence order method. The method comprises the following steps for corroding grooves: performing grooving and corroding by using a sequential method and a reverse sequence method alternately, and dividing the chips into N shelves in sequence; and grading all the chips by depth of the grooves, dividing the chip into M shelves, and putting the chips into an acid bath respectively to be grooved to a required depth. M and N are equal or not equal. By using a precedence order method which alternately uses the sequential method and the reverse sequence method and using a final step of grading and grooving, the method effectively solves the problem of inconsistent groove width and depth in the GPP product production due to corrosion capacity change resulting from corrosion liquid proportion change caused by the use of the sequential method and continuous corrosion in conventional grooving, and ensures GPP grooves can maintain uniform and even groove width and depth in the process of grooving and corroding, thereby improving product qualification rate in the process of production, groove shapes and the reliability of packed power products.

Description

Technical field [0001] The invention relates to a production process of a GPP chip, in particular to a trenching corrosion process of a GPP chip in the production process. Background technique [0002] GPP (Glass passivation powder) refers to the passivation of the surface of the chip with glass powder, which plays a role in protecting the circuit of the chip. It first needs to draw grooves on the surface of the chip, and the grooves can be etched, and then glass powder is coated in the grooves for passivation. [0003] The current GPP ditching etching process method has the following disadvantages: during the etching process, as the number of times the etching solution etches the GPP chip increases, the ratio of the chemical composition of the etching solution changes, and the etching ability of the etching solution becomes weak. As a result, the shapes of the GPP grooves corroded before and after are inconsistent, resulting in the weakening of the conduction capacity and the pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/306H01L21/00
Inventor 王坚红
Owner 安徽钜芯半导体科技有限公司
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