Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

One-way separation type extensible interconnection mother board

A separate, unidirectional technology, applied in the direction of electrical connection of printed components, structural connection of printed circuits, contact parts, etc., can solve the problems that circuit modules cannot be drawn out arbitrarily, cannot be expanded, and achieve rich types and forms, convenient and fast Clutch, increase the effect of expanding space

Inactive Publication Date: 2011-06-22
10TH RES INST OF CETC
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Once the total number of signal line core wires exceeds the specified amount or the number of printed circuit board unit circuit modules accommodated, the number of plug-in channels / port cores of the printed circuit board unit circuit module must be restricted by the interconnection of the motherboard and cannot be expanded
Secondly, the circuit modules interconnected by the upper and lower motherboards cannot be drawn out arbitrarily.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • One-way separation type extensible interconnection mother board
  • One-way separation type extensible interconnection mother board
  • One-way separation type extensible interconnection mother board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] refer to Figure 1 to Figure 7 . The present invention will be described step by step below in conjunction with the accompanying drawings and examples. In the following drawings and implementations, the circuit module 2 still uses figure 1 As shown, in the chassis 1 , a conventional motherboard 3 is used below to interconnect the circuit modules. When the total amount of signal line core wires exceeds the specified amount of the plug-in channel / port core number of the printed circuit board unit circuit module or the number of circuit modules accommodated, it is used above the circuit module 2, and the present invention is interconnected by at least one PCB rigid printed board. The main interconnection motherboard 5 and two unidirectionally separated expandable interconnection motherboards composed of PCB rigid printed board sub-interconnection motherboards 4 and 6 interconnect the circuit module 2 to facilitate the arbitrary insertion and removal of the circuit module...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a one-way separation type extensible interconnection mother board, and aims to provide a mother board which has compact structure, close cooperation, quick connection and disconnection, can facilitate replacement of circuit modules and extend the number of cores of channels / ports of the circuit modules. The mother board comprises at least one PCB rigid printed board master connection mother board and two PCB rigid printed board auxiliary connection mother boards, wherein joint surfaces of coupled step platforms which are connected and combined with each other are arranged on side ends of the main connection mother board and the auxiliary connection mother boards; the step platforms are respectively fixedly connected with an elastic contact miniature connector conducting a circuit module line; the joint surface of the coupled step platforms of the auxiliary connection mother boards are fixedly connected with linear array contacts; the circuit module line is conducted through point contact of the miniature elastic connector on the step surface of the main connection mother board. The one-way separation type extensible interconnection mother board avoids the inherent defect of inseparable integration after the conventional bus mother boards or rigid flexible interconnection mother boards are interconnected, and solves the problem that other side surfaces ofseveral different interconnected circuit modules can not perform mother board interconnection.

Description

technical field [0001] The invention relates to a mother board used for plugging different printed circuit board units and interconnecting circuit modules in the engineering application of modularized electronic equipment. Background technique [0002] In the prior art, the motherboard that uses bus interconnection, plugs in different printed circuit board units, and transmits electrical signals of circuit modules is usually an integrated and inseparable bus motherboard, and uses an integrated printed board to carry out the circuit module on one side. interconnection. This kind of motherboard that cannot be separated and interconnected cannot be interconnected on other sides between several different interconnected circuit modules, thus restricting the simultaneous interconnection and separation of different circuit modules around and further expansion of circuit functions in the module. Once the total number of plug-in channels / port signal lines on the motherboard exceeds ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/14H05K1/11H05K3/36H01R13/24
Inventor 郑大安
Owner 10TH RES INST OF CETC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products