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Polishing pad and manufacturing method thereof

A manufacturing method and polishing pad technology, which can be used in the manufacture of tools, abrasives, metal processing equipment, etc., can solve the problems of reducing the service life of polishing pads, storing debris in holes, and reducing bonding ability.

Inactive Publication Date: 2009-12-30
SAN FANG CHEM IND
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  • Abstract
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  • Claims
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AI Technical Summary

Problems solved by technology

In addition, if the back glue is immersed in the polishing solution for a long time, the bonding ability will be gradually reduced, resulting in poor flatness of the surface of the polishing pad.
In addition, when performing polishing operations and applying pressure through the polishing machine to polish the object to be polished, the protruding part of the surface of the polishing pad is likely to cause serious wear of the abrasive layer, and it is easy to scratch the surface of the object to be polished
[0005] Furthermore, the conventional polishing pad is limited by the thickness of the abrasive layer, so it cannot have longer holes to store the polishing liquid and the residue generated after polishing, and it is easy to cause the holes to be filled with the residue generated after polishing and gradually become smaller, thus reducing the Polishing effect, and reduce the life of the polishing pad

Method used

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  • Polishing pad and manufacturing method thereof
  • Polishing pad and manufacturing method thereof
  • Polishing pad and manufacturing method thereof

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Embodiment Construction

[0013] The invention provides a polishing pad, which is used for grinding or polishing an element to be polished in a chemical mechanical polishing (CMP) process. The components to be polished include (but are not limited to) objects such as semiconductors, storage media base materials, integrated circuits, LCD flat glass, optical glass, and photoelectric panels.

[0014] refer to figure 1 , which shows a schematic diagram of the polishing pad of the present invention. The polishing pad 1 includes a base material 11 and a polishing layer 12 . In this embodiment, the base material 11 is formed by covering the fiber layer 112 with a polymer body 111 , and the base material 11 has a surface 113 . Preferably, said surface 113 is a planarized surface. The fiber layer 112 can be cloth material (for example: non-woven fabric). In this embodiment, the polymer body 111 is a continuous foam. Wherein, the polymer body 111 is selected from polyurea ester (PU), polypropylene (PP), pol...

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Abstract

The invention relates to a polishing pad and a manufacturing method thereof. A liquid polymer material is directly formed on the surface of a substrate material and is solidified to form an even grinding layer, thereby the polishing pad has better integrative performance and better flatness, otherwise, the grinding layer has a long structure and is provided with a plurality of holes which have better inclusion ability for grinding particles in grinding liquid, moreover, the polishing pad has a higher compression ratio, and the polishing pad is in tight contact with an object to be polished and can not scuff the surface of the object to be polished, therefore, the grinding efficiency and the quality can be improved.

Description

technical field [0001] The invention relates to a polishing pad and its manufacturing method, in particular to a polishing pad with an abrasive layer directly formed on the surface of a base material and its manufacturing method. Background technique [0002] General polishing is with chemical mechanical polishing (CMP) process, and for the grinding of rough surface, it utilizes the abrasive liquid that contains abrasive particles to be evenly distributed on the surface of the polishing pad, and simultaneously with the component to be polished against the polishing pad, repeat and Regular rubbing action. The components to be polished are objects such as semiconductors, storage media base materials, integrated circuits, LCD flat glass, optical glass, and optoelectronic panels. [0003] In the conventional technology, it is made into a polishing pad with a multi-layer bonding method, for example: the grinding layer and the base material are bonded with a back glue (please ref...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D11/00B24D11/02
Inventor 冯崇智王俊达洪永璋姚伊蓬
Owner SAN FANG CHEM IND
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