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Substrate processing apparatus

A substrate processing device and substrate technology, applied in optics, instruments, optomechanical equipment, etc., can solve the problems of increased exhaust volume, inability to reduce exhaust volume, increase the number of coater covers, etc., to improve exhaust efficiency, The effect of preventing liquid mist

Active Publication Date: 2009-12-30
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, there is a problem that as the processing capacity increases, it is necessary to increase the number of coater hoods installed, so that the exhaust volume increases accordingly, and the exhaust capacity of the factory becomes tight
In order to solve this problem, it is considered to reduce the exhaust volume, but in order to achieve the purpose of preventing the liquid mist when discharging the resist and cleaning liquid, the exhaust volume cannot be reduced.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0061] Figure 4 is a schematic cross-sectional view showing a state during resist coating in the first embodiment of the resist coating processing apparatus 15, Figure 5 It is a schematic cross-sectional view showing a state of forming a resist film after supplying a resist.

[0062] The resist coating processing apparatus 15 includes: a spin chuck 16 that holds the wafer W horizontally by vacuum suction on its upper surface as a holding unit for the wafer W; A rotation mechanism 16b composed of, for example, a servo motor rotating in a horizontal plane; a processing liquid supply nozzle 17 (hereinafter referred to as coating nozzle 17) for supplying a resist to the surface of the wafer W; and a cleaning liquid such as pure water supplied to the surface of the wafer W. a cleaning nozzle (not shown); a backside cleaning nozzle (not shown) for supplying a cleaning solution such as pure water to the backside of the wafer W; an edge backside cleaning nozzle (not shown) for supp...

no. 2 approach

[0077] Figure 9 is a schematic cross-sectional view showing a state when the resist coating processing apparatus 15 is coating a resist in the second embodiment, Figure 10 It is a schematic cross-sectional view showing a resist film formation state after supplying a resist solution.

[0078] The second embodiment is formed using a plurality of vertically arranged rod-shaped members 76 capable of opening and closing the upper end openings of the respective air holes 66 , and an annular disc-shaped connecting member 77 connecting the upper ends of the respective rod-shaped members 76 to each other. The case of the opening and closing member 67A.

[0079] In this case, the rod member 76 passes through the through hole 62e provided on the inward flange portion 62d at the upper end of the cover 62, and its lower end closed portion has a narrow conical surface 76a that can be inserted into the vent hole 66. In this way, by providing the narrow conical surface 76a on the lower en...

no. 3 approach

[0087] Figure 13 is a schematic cross-sectional view showing a state when the resist coating processing apparatus 15 is coating a resist in the second embodiment, Figure 14 It is a schematic cross-sectional view showing a resist film formation state after supplying a resist solution.

[0088] The third embodiment is a case in which an opening and closing member is constituted by a member that opens and closes an annular air inlet 78 communicating with the vent hole 66 , for example, an annular member 79 .

[0089] In this case, the outer cover 62 includes an outer cover body 62d in which a vent hole 66 provided in the intermediate cover 64 communicates with the outer side of the outer cover 62 and an annular air inlet 78 is provided between the outer wall portion 62a. The annular member 79 that opens and closes the annular air inlet 78 formed by the exterior cover 62d and the outer wall portion 62a is provided with an elevating mechanism such as an elevating cylinder 68B ha...

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Abstract

The invention provides a substrate processing apparatus to form a resist film by supplying a resist liquid to a surface of a wafer (W) rotated by a rotating chuck (16) from a spraying nozzle (17) and expanding the surface, comprising an outer cover (62) surrounding an outer side wall (62a) at outside of the wafer kept by the rotating chuck, an inner cover located below an outer periphery of the wafer, and a middle cover (64) fixed on an inner periphery of the outer side wall of the cover, meanwhile located at a gap (65) between the inner periphery of the outer side wall of the cover and the outer periphery of the wafer and communicating with a plurality of vents (66) at an upper part of the outer cover and the outer side of the inner cover. When supplying the resist, the vents are closed by a closing part, and airflow is blocked. When forming the resist film, the vents are opened and airflow can flow through the vents.

Description

technical field [0001] The present invention relates to a substrate processing apparatus for forming a processing film such as a resist on a substrate such as a semiconductor wafer or an FPD (Flat Panel Display) substrate. Background technique [0002] In general, in the manufacture of semiconductor components, photolithography is used to apply photosensitive agents on substrates such as semiconductor wafers and FPD substrates, expose mask patterns and then form circuit patterns. In this photolithography technique, a resist is applied on a wafer by spin coating, the thus formed resist film is exposed according to a prescribed circuit pattern, and the exposed pattern is developed, thereby forming a A circuit pattern is formed on the resist film. [0003] Generally, in the spin coating method, a substrate such as a wafer is rotated in a coater cover composed of an outer cover and an inner cover in order to receive scattered resist. [0004] In addition, in order to prevent t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00
CPCG03F7/162G03F7/70933H01L21/6715
Inventor 高柳康治吉原孝介
Owner TOKYO ELECTRON LTD
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