Method and device thereof for linearly cutting silicon slice
A wire cutting and silicon wafer technology, which is used in sawing machine devices, fine working devices, metal sawing equipment, etc., can solve the problems of large thickness deviation, waste of slice thickness, and different thicknesses, so as to improve the quality of slices and improve the quality of slices. Quantity, the effect of increasing the number and quality of slices
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[0031] The present invention is a device for implementing the above silicon wafer wire cutting method, which is figure 2 with image 3 On the basis of the device shown, the guide wheel is mainly improved to adapt it to the requirement of wire mesh encryption. The device mainly includes a guide wheel 1 with a wire slot, and a steel wire mesh 2 wound on the guide wheel 1. The slot distance on the guide wheel 1 is originally equidistant. The main feature of the present invention is that the guide wheel The slot pitch on 1 is changed to an unequal slot pitch. The unequal slot pitch starts from the steel wire winding guide wheel and decreases sequentially along the length of the guide wheel, so that the winding is wound on the guide wheel. The wire mesh on the wheel trunking is gradually dense. There are two implementation methods for the unequal slot pitch on the guide wheel:
[0032] In the first embodiment, the unequal slot pitch on the guide wheel 1 is along the length of the gu...
Example Embodiment
[0035] Example one
[0036] Such as Figure 4 As shown, the slot pitch on the guide wheel 1 is unequal. It is divided into three unequal slot pitches along the length of the guide wheel. The slot pitch on the two adjacent sections is from steel The first section of the wire wound on the guide wheel 1 begins to decrease sequentially, and there are several wire grooves with equal slot pitch on each section. Such as Figure 4 As shown, in the length direction of the guide wheel 1, it is divided into three unequal slot pitches according to the slot length L1, that is, the slot pitch of the first section A>the slot pitch of the second section B> The slot pitch of the third section C. The slot pitches on the first section A, the second section B, and the third section C are respectively equal.
[0037] Based on the above technical features, the applicant has made improvements on the following types of silicon wafer wire cutting devices:
[0038] A. Existing Swiss MEYER BURGER DS265 guid...
Example Embodiment
[0045] Example two
[0046] Such as Figure 5 As shown, the slot pitch on the guide wheel 1 is unequal. It is divided into 8 unequal slot pitches along the length of the guide wheel. The slot pitch on the two adjacent sections is made from steel The first section of the wire wound on the guide wheel 1 begins to decrease sequentially, and there are several wire grooves with equal slot pitch on each section.
[0047] Based on the above technical features, the applicant has made improvements on the following types of silicon wafer wire cutting devices:
[0048] A. Existing Swiss MEYER BURGER DS264 guide wheel groove pitch structure:
[0049] Slotting length L2 = 820mm, the total number of slots is 2448, and the slot pitch is 0.335mm.
[0050] B. Increase the number of slots after improvement:
[0051] Using Swiss MEYER BURGER DS264 machine, under the condition of slotting length L2=820mm, please refer to Figure 5 , The grooving method is divided into 8 sections of grooving, and the groo...
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