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Solar cell packaging EVA adhesive film capable of resisting heat, humidity, ultraviolet light and aging

A solar cell, ultraviolet light technology, applied in applications, circuits, adhesives, etc., can solve the problems of poor control of processing and production, high activity ratio, low activity ratio, etc., achieve high visible light transmittance, increase cross-linking density, The effect of improving cross-linking efficiency

Inactive Publication Date: 2011-10-05
苏州爱康商务咨询服务有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

2,5-Xylene-2,5-bis(tert-butylperoxy)hexane has a half-life temperature of 132°C for 1 hour, relatively low activity, and the temperature of the cross-linking reaction with EVA is too high, which cannot meet the requirements of the current market. need
The half-life temperature of 1,1-(bisperoxy-tert-butyl) 3,3,5-trimethylcyclohexane is 112°C for 1 hour, the activity is relatively high, and the temperature of the cross-linking reaction with EVA is too low. Not easy to control, easy to agglomerate

Method used

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  • Solar cell packaging EVA adhesive film capable of resisting heat, humidity, ultraviolet light and aging
  • Solar cell packaging EVA adhesive film capable of resisting heat, humidity, ultraviolet light and aging
  • Solar cell packaging EVA adhesive film capable of resisting heat, humidity, ultraviolet light and aging

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049]Add 0.5 mass parts tackifier r-glycidyl ether oxypropyltrimethoxysilane, 1 mass part of cross-linking solidification in 100 mass parts vinyl acetate content is 32%, melt index value is 30g / 10min EVA raw material Agent tert-butyl peroxide 2-ethylhexyl carbonate, 0.1 parts by mass of crosslinking curing accelerator triallyl isocyanurate, 0.2 parts by mass of antioxidant bis(2,4-dicumylbenzene base) pentaerythritol diphosphite, 0.25 parts by mass of ultraviolet light absorber fumed silica and 0.1 mass part of ultraviolet light stabilizer polysuccinic acid (4-hydroxyl-2,2,6,6-tetramethyl- 1-1 piperidine ethanol) ester is mixed evenly and put into an extruder for mixing and plasticizing, and the temperature of the extruder is controlled at 83°C. The extruded product is calendered, cooled, drawn, and coiled to obtain a solar EVA film F-1 with a thickness of 0.5 mm.

Embodiment 2

[0051] Add 0.5 mass parts tackifier r-glycidyl ether oxypropyltrimethoxysilane, 1 mass part of cross-linking solidification in 100 mass parts vinyl acetate content is 32%, melt index value is 30g / 10min EVA raw material Agent tert-butyl peroxide 2-ethylhexyl carbonate, 0.1 parts by mass of cross-linking curing accelerator triallyl isocyanurate, 0.2 parts by mass of antioxidant three (2,4-di-tert-butyl Phenyl) phosphite, the antioxidant tri(nonylphenyl) phosphite of 0.15 mass parts, the ultraviolet light absorber fumed silica of 0.28 mass parts and the ultraviolet light stabilizer bis(2 of 0.1 mass part, 2,6,6-Tetramethyl-4-piperidinyl) sebacate was mixed evenly and put into an extruder for mixing and plasticization, and the temperature of the extruder was controlled at 83°C. The extruded product is calendered, cooled, drawn, and coiled to obtain a solar EVA film F-2 with a thickness of 0.5 mm.

Embodiment 3

[0053] Add 0.4 mass parts of tackifier r-glycidyl ether oxypropyltrimethoxysilane, 1.2 mass parts of cross-linking solidification in 100 mass parts of EVA raw materials with vinyl acetate content of 32% and melt index value of 30g / 10min Agent tert-butyl peroxide 2-ethylhexyl carbonate, 0.08 parts by mass of crosslinking curing accelerator triallyl isocyanurate, 0.2 parts by mass of antioxidant bis(2,4-dicumylbenzene Base) pentaerythritol diphosphite, 0.2 mass parts of antioxidant distearyl pentaerythritol diphosphite, 0.2 mass parts of ultraviolet absorber fumed silica and 0.1 mass parts of ultraviolet light stabilizer polysuccinic acid (4-Hydroxy-2,2,6,6-tetramethyl-1-1 piperidine ethanol) ester was mixed uniformly and put into an extruder for mixing and plasticization, and the temperature of the extruder was controlled at 87°C. The extruded product is calendered, cooled, drawn, and coiled to obtain a solar EVA film F-3 with a thickness of 0.5mm.

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Abstract

The invention relates to a solar cell packaging EVA adhesive film capable of resisting heat, humidity, ultraviolet light and aging, which comprises the following materials by weight portions: 100 portions of copolymer of ethylene vinyl acetate, 0.8-1.4 portions of crosslink curing agent, 0.05-0.15 portion of crosslink curing accelerator, 0.2-0.6 portion of tackifier, 0.1-0.5 portion of antioxidant, 0.05-0.25 portion of ultraviolet light stabilizer and 0.1-0.3 portion of ultraviolet light absorbent, wherein the crosslink curing agent is tert butyl peroxy 2-ethyl hexyl carbonate; the crosslink curing accelerator is triallyl isocyanurate; the tackifier is r-glycidyl ether oxy-propylltrimethoxysilane; the antioxidant is one or two selected from the group consisting of bis(2,4-dicumylphenyl)pentaerythritol diphosphite, distearyl pentaerythritol diphosphite, tris(nonyl phenyl)phosphate and tris(2,4-butylphenyl)phosphate; and ultraviolet light absorbent is gas phase silicon dioxide. The solar cell packaging EVA adhesive film can resist high temperature of 85 DEG C, humidity of 85 percent, ultraviolet light and thermal oxidative aging.

Description

(1) Technical field [0001] The invention relates to an EVA adhesive film used for encapsulating solar cells resistant to damp heat, ultraviolet light and thermal oxygen aging. (2) Background technology [0002] The problems of global environmental pollution and energy shortage are becoming more and more serious, and solar cell power generation is one of the most effective ways to solve these two problems. Solar power generation uses the quantum effect principle of semiconductors such as silicon to directly convert the visible light of the sun into electrical energy. However, if the silicon wafer is directly exposed to the atmosphere, its photoelectric conversion performance is easily attenuated and loses its practical value. Therefore, a new type of encapsulation material must be used to protect the silicon wafer accordingly. [0003] First of all, the packaging material must have a high enough light transmittance to ensure high photoelectric conversion efficiency of the pa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L31/0203C09J123/08H01L31/048
CPCB32B17/10788B32B17/10678B32B2457/12
Inventor 周先国邹承慧
Owner 苏州爱康商务咨询服务有限公司
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