Radiating structure and preparation method thereof

Abstract

A radiating structure is fixedly arranged on the surface of a heating element. The radiating structure comprises a patterned carbon nanotube array and a fixing layer, and is fixed on the heating element through the fixing layer. A preparation method for the radiating structure comprises the following steps: providing the heating element which has a surface; arranging the molten fixing layer on the surface of the heating element; preparing the carbon nanotube array to form on a substrate, wherein the carbon nanotube array has a first end and a second end, and the second end is opposite to the first end and is connected with the substrate; inserting the first end of the carbon nanotube array into the fixing layer and cooling the fixing layer until the fixing layer is solidified; removing the substrate of the carbon nanotube array; and patterning the carbon nanotube array to form the radiating structure on the surface of the heating element.

Description

technical field [0001] The invention relates to a heat dissipation structure and a preparation method thereof, in particular to a heat dissipation structure based on carbon nanotubes and a preparation method thereof. Background technique [0002] In recent years, with the rapid development of the integration process of semiconductor devices, the degree of integration of semiconductor devices is getting higher and higher, and the operating frequency of semiconductor integrated devices (such as CPU) is also getting higher and higher, and the heat generated per unit time increases. The accumulation will cause the temperature to rise, which will lead to the decrease of the operating performance of the semiconductor integrated device including the stability. Therefore, it is necessary to dissipate the heat generated in time. At present, heat dissipation has become a problem that must be solved in the semiconductor integration process. [0003] With the reduction of the device vol...

AI Technical Summary

Problems solved by technology

However, since carbon nanotubes are generally arranged in disorder in thermal interface materials, the advantages of longitudinal heat conduction of carbon nanotubes cannot be fully utilized. Therefore, the heat dissipation efficiency of this heat dissipation structure has not been significantly improved.

At the same time, since this heat dissipation structure also needs to include thermal interface materials and heat sinks at the same time, the volume of the heat dissipation structure is limited and cannot meet the requirements of tiny devices.

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