Tool setter of sharpening grinding wheel of semiconductor wafer

A tool setting device, semiconductor technology, applied in the direction of grinding device, semiconductor/solid device manufacturing, grinding/polishing equipment, etc., can solve the problems of slow feed speed, long stroke of the grinding wheel spindle, and low efficiency of semiconductor wafer grinding , to achieve the effect of shortening the idle stroke and improving the grinding efficiency
CN101633152AInactive Publication Date: 2010-01-27WUXI MACHINETOOL +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
WUXI MACHINETOOL
Publication Date
2010-01-27
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to a tool setter of a sharpening grinding wheel of a semiconductor wafer. The invention can complete the tool setting of the grinding wheel before the semiconductor wafer is sharpened, shorten the idle stroke of a main shaft of the grinding wheel during sharpening and enhance the sharpening efficiency of the semiconductor wafer. The tool setter of the sharpening grinding wheel of the semiconductor wafer comprises the main shaft of the grinding wheel, a feeding device of the main shaft of the grinding wheel, the grinding wheel and a sucking disk. The tool setter of the sharpening grinding wheel of the semiconductor wafer is characterized in that a microswitch with determined height is arranged in a space on the lower surface of the grinding wheel and the upper surface of the sucking disk, one end of the microswitch is provided with a switch contact, and the microswitch is connected with a driving device by a connecting piece arranged at the side part.
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Description

(1) Technical field

[0001] The invention relates to the technical field of semiconductor wafer processing devices, in particular to a semiconductor wafer grinding wheel tool setting device. (2) Background technology

[0002] During the semiconductor wafer grinding process, the grinding wheel will be continuously consumed when grinding the semiconductor wafer; the suction cup that absorbs the semiconductor wafer is trimmed, etc., which will cause the idle stroke of the grinding wheel to become larger and larger. The feed rate is very slow, and since the idle stroke of the grinding wheel becomes larger and larger, the entire stroke of the grinding wheel spindle becomes longer and longer during grinding, which leads to low grinding efficiency of the semiconductor wafer. (3) Contents of the invention

[0003] In view of the problems referred to above, the invention provides a kind of semiconductor wafer grinding wheel tool setting device, which can complete the tool setting of...

Claims

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